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Co-authors
- Hui KongBeijing Institute of TechnologyVerified email at bit.edu.cn
- Yong HaoVerified email at iet.cn
- Wenjia LiTianjin UniversityVerified email at tju.edu.cn
- Bingzheng WangCornell University, Systems Engineering, Ph.D.Verified email at cornell.edu
- Sean-Thomas B. LundinNational Institute of Advanced Industrial Science and Technology (AIST)Verified email at aist.go.jp
- Mingkai Liu (刘明恺)Institute of Engineering Thermophysics, Chinese Academy of SciencesVerified email at iet.cn
- Han WeiInstitute of Engineering Thermophysics, CASVerified email at iet.cn
- Meng NiProfessor, Associate Dean (Research), The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
- Gang PeiUniversity of science and technology of chinaVerified email at ustc.edu.cn
- YIXIANG SHITsinghua UniversityVerified email at tsinghua.edu.cn
- Duanxing LIUniversity of TokyoVerified email at chemsys.t.u-tokyo.ac.jp
- Francesco CiucciUniversity of BayreuthVerified email at uni-bayreuth.de
- Kazuhiro TakanabeThe University of TokyoVerified email at chemsys.t.u-tokyo.ac.jp
- Zheng Bo (薄拯)Professor of Zhejiang UniversityVerified email at zju.edu.cn
- wei haiqiaotianjin UniversityVerified email at tju.edu.cn
- Jian Wang (王健)City University of Hong Kong, HKUST, XJTU,SNU, Northwestern UniversityVerified email at cityu.edu.hk
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Hongsheng Wang (王宏圣)
中国科学院大学副教授, University of Chinese Academy of Sciences (UCAS), Associate Professor
Verified email at ucas.ac.cn