| Architecture of cobweb-based redundant TSV for clustered faults T Ni, D Liu, Q Xu, Z Huang, H Liang, A Yan IEEE transactions on very large scale integration (VLSI) systems 28 (7 …, 2020 | 154 | 2020 |
| Information assurance through redundant design: A novel TNU error-resilient latch for harsh radiation environment A Yan, Y Hu, J Cui, Z Chen, Z Huang, T Ni, P Girard, X Wen IEEE Transactions on Computers 69 (6), 789-799, 2020 | 83 | 2020 |
| LCHR-TSV: Novel low cost and highly repairable honeycomb-based TSV redundancy architecture for clustered faults T Ni, Y Yao, H Chang, L Lu, H Liang, A Yan, Z Huang, X Wen IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019 | 63 | 2019 |
| Novel quadruple-node-upset-tolerant latch designs with optimized overhead for reliable computing in harsh radiation environments A Yan, Z Xu, X Feng, J Cui, Z Chen, T Ni, Z Huang, P Girard, X Wen IEEE transactions on emerging topics in computing 10 (1), 404-413, 2020 | 62 | 2020 |
| Novel speed-and-power-optimized SRAM cell designs with enhanced self-recoverability from single-and double-node upsets A Yan, Y Chen, Y Hu, J Zhou, T Ni, J Cui, P Girard, X Wen IEEE Transactions on Circuits and Systems I: Regular Papers 67 (12), 4684-4695, 2020 | 54 | 2020 |
| A novel TDMA-based fault tolerance technique for the TSVs in 3D-ICs using honeycomb topology T Ni, Z Yang, H Chang, X Zhang, L Lu, A Yan, Z Huang, X Wen IEEE transactions on emerging topics in computing 9 (2), 724-734, 2020 | 54 | 2020 |
| Non-intrusive online distributed pulse shrinking-based interconnect testing in 2.5 D IC T Ni, H Chang, T Song, Q Xu, Z Huang, H Liang, A Yan, X Wen IEEE transactions on circuits and systems II: express briefs 67 (11), 2657-2661, 2019 | 54 | 2019 |
| Quadruple and sextuple cross-coupled SRAM cell designs with optimized overhead for reliable applications A Yan, J Xiang, A Cao, Z He, J Cui, T Ni, Z Huang, X Wen, P Girard IEEE Transactions on Device and Materials Reliability 22 (2), 282-295, 2022 | 40 | 2022 |
| A methodology for characterization of SET propagation in SRAM-based FPGAs H Liang, X Xu, Z Huang, C Jiang, Y Lu, A Yan, T Ni, Y Ouyang, M Yi IEEE Transactions on Nuclear Science 63 (6), 2985-2992, 2016 | 38 | 2016 |
| Design of true random number generator based on multi-stage feedback ring oscillator J Cui, M Yi, D Cao, L Yao, X Wang, H Liang, Z Huang, H Qi, T Ni, Y Lu IEEE Transactions on Circuits and Systems II: Express Briefs 69 (3), 1752-1756, 2021 | 35 | 2021 |
| A cost-effective TSV repair architecture for clustered faults in 3-D IC T Ni, Q Xu, Z Huang, H Liang, A Yan, X Wen IEEE transactions on computer-aided design of integrated circuits and …, 2020 | 35 | 2020 |
| Designs of two quadruple-node-upset self-recoverable latches for highly robust computing in harsh radiation environments A Yan, Z Li, J Cui, Z Huang, T Ni, P Girard, X Wen IEEE Transactions on Aerospace and Electronic Systems, 2022 | 34 | 2022 |
| LDAVPM: A latch design and algorithm-based verification protected against multiple-node-upsets in harsh radiation environments A Yan, Z Li, J Cui, Z Huang, T Ni, P Girard, X Wen IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022 | 30 | 2022 |
| Thermodynamic and economic analysis of a novel cascade waste heat recovery system for solid oxide fuel cell T Ni, J Si, X Gong, K Zhang, M Pan Energy Conversion and Management 259, 115562, 2022 | 23 | 2022 |
| Performance analysis and optimization of cascade waste heat recovery system based on transcritical CO2 cycle for waste heat recovery in waste-to-energy plant T Ni, J Si, F Lu, Y Zhu, M Pan Journal of Cleaner Production 331, 129949, 2022 | 23 | 2022 |
| Temperature-aware floorplanning for fixed-outline 3D ICs T Ni, H Chang, S Zhu, L Lu, X Li, Q Xu, H Liang, Z Huang IEEE Access 7, 139787-139794, 2019 | 21 | 2019 |
| A pulse shrinking-based test solution for prebond through silicon via in 3-D ICs M Yi, J Bian, T Ni, C Jiang, H Chang, H Liang IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 20 | 2018 |
| A highly reliable butterfly PUF in SRAM-based FPGAs X Xu, H Liang, Z Huang, C Jiang, Y Ouyang, X Fang, T Ni, M Yi IEICE Electronics Express 14 (14), 20170551-20170551, 2017 | 18 | 2017 |
| Calibration of SQUID magnetometers in multichannel MCG system based on bi-planar coil K Yang, D Wu, W Gao, T Ni, Q Zhang, H Zhang, D Huang IEEE Transactions on Instrumentation and Measurement 71, 1-9, 2022 | 16 | 2022 |
| Nonvolatile Latch Designs With Node-Upset Tolerance and Recovery Using Magnetic Tunnel Junctions and CMOS A Yan, L Wang, J Cui, Z Huang, T Ni, P Girard, X Wen IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | 15 | 2023 |
Xiaoqing WenKyushu Institute of TechnologyVerified email at cse.kyutech.ac.jp
