| Review of silver nanoparticle based die attach materials for high power/temperature applications SA Paknejad, SH Mannan Microelectronics Reliability 70, 1-11, 2017 | 206 | 2017 |
| Microstructure evolution during 300 C storage of sintered Ag nanoparticles on Ag and Au substrates SA Paknejad, G Dumas, G West, G Lewis, SH Mannan Journal of Alloys and Compounds 617, 994-1001, 2014 | 118 | 2014 |
| Thermally stable high temperature die attach solution SA Paknejad, A Mansourian, Y Noh, K Khtatba, SH Mannan Materials & Design 89, 1310-1314, 2016 | 32 | 2016 |
| Microstructural evolution of sintered silver at elevated temperatures SA Paknejad, A Mansourian, J Greenberg, K Khtatba, L Van Parijs, ... Microelectronics Reliability 63, 125-133, 2016 | 28 | 2016 |
| Elastic relaxation in an ultrathin strained silicon-on-insulator structure G Xiong, O Moutanabbir, X Huang, SA Paknejad, X Shi, R Harder, ... Applied Physics Letters 99 (11), 2011 | 23 | 2011 |
| Tunable ultra-high aspect ratio nanorod architectures grown on porous substrate via electromigration A Mansourian, SA Paknejad, Q Wen, G Vizcay-Barrena, RA Fleck, ... Scientific Reports 6 (1), 22272, 2016 | 20 | 2016 |
| Stereoscopic nanoscale-precision growth of free-standing silver nanorods by electron beam irradiation A Mansourian, SA Paknejad, AV Zayats, SH Mannan The Journal of Physical Chemistry C 120 (36), 20310-20314, 2016 | 11 | 2016 |
| Ultra-stable sintered silver die attach for demanding high-power/temperature applications SA Paknejad, K Khtatba, A Mansourian, SH Mannan IEEE Transactions on Device and Materials Reliability 17 (4), 795-798, 2017 | 4 | 2017 |
| Factors influencing microstructural evolution in nanoparticle sintered Ag die attach SA Paknejad, A Mansourian, Y Noh, K Khtatba, L Van Parijs, SH Mannan Additional Papers and Presentations 2015 (HiTEN), 000050-000058, 2015 | 4 | 2015 |
| Arresting high-temperature microstructural evolution inside sintered silver K Khtatba, SA Paknejad, T Al Zoubi, H Qutaish, N Sano, SH Mannan Journal of Materials Science: Materials in Electronics 30, 463-474, 2019 | 3 | 2019 |
| Sintered silver die attach with extreme thermal stability for extreme and dynamic environments K Khtatba, SA Paknejad, A Mansourian, SH Mannan Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2017 (HiTEN …, 2017 | 1 | 2017 |
| Microstructural evolution and arrest in a silver nanoparticle based die attach material for extreme environments SA Paknejad King's College London, 2017 | 1 | 2017 |
| Comparative study of how additives affect sintered silver microstructure in die-attach applications M Lo, SA Paknejad, H Borrill, WK Kong, A Addo-Kwabena, M Saidoune, ... Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (HiTen …, 2019 | | 2019 |
| Internal Structure Refinement of Porous Sintered Silver via Electromigration A Mansourian, SA Paknejad, Q Wen, K Khtatba, AV Zayats, SH Mannan Additional Papers and Presentations 2016 (HiTEC), 000190-000195, 2016 | | 2016 |
| Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current Density A Mansourian, SA Paknejad, Q Wen, K Khtatba, A Zayats, SH Mannan Additional Papers and Presentations 2015 (HiTEN), 000059-000063, 2015 | | 2015 |
