| A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems I Ndip, K Andersson, S Kosmider, TH Le, A Kanitkar, M van Dijk, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 101-107, 2020 | 10 | 2020 |
| Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave Applications TH Le, I Ndip, O Schwanitz, S Kosmider, KS Murugesan, U Maass, ... 2022 16th European Conference on Antennas and Propagation (EuCAP), 1-4, 2022 | 7 | 2022 |
| High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications KS Murugesan, M Chernobryvko, S Zinal, M Rossi, I Ndip, M Boettcher, ... 2020 50th European Microwave Conference (EuMC), 89-92, 2021 | 7 | 2021 |
| PCB Embedding Technology for 5G mmWave Applications S Kosmider, T Löher, A Ostmann, K Murugesan, U Maaß, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 2 | 2022 |
| Mold based D-band slotted SIW bandpass filter M Chernobryvko, A Kanitkar, F Müller, O Schwanitz, I Ndip, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 2 | 2022 |
| Modeling and Measurement of Double Stacked Microvia in Antenna-in-Package Module for 5G mmWave Applications KS Murugesan, S Kosmider, O Schwanitz, U Maaß, I Ndip, A Ostmann, ... 2021 51st European Microwave Conference (EuMC), 10-13, 2022 | 2 | 2022 |
| Development of innovative substrate and embedding technologies for high frequency applications D Manessis, S Kosmider, L Boettcher, M Seckel, K Murugesan, U Maaß, ... 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 2 | 2021 |
| Packaging Technologies and Challenges Towards 5G Integration of mm-wave Components and Silicon ICs T Lim, M Kaiser, M Obst, T Braun, M van Dijk, J Jaeschke, L Böttcher, ... Technologies Enabling Future Mobile Connectivity & Sensing, 71, 2024 | | 2024 |
| High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications M Chernobryvko, MP Kaiser, KS Murugesan, D Kuylenstierna, ... 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | | 2023 |
| Design and Measurement of Interconnects in Fan-Out Wafer-Level Packaging (FOWLP) for mm-Wave Applications up to 100 GHz S Zinal, KS Murugesan, M Rossi, M Böttcher, I Ndip, KD Lang, M Wieland, ... 2021 51st European Microwave Conference (EuMC), 2-5, 2022 | | 2022 |
| Compact Wideband Wilkinson Power Divider in Thin-Film Glass Technology for 5G Applications KS Murugesan, T Voigt, C Tschoban, M Rossi, I Ndip, KD Lang, ... MikroSystemTechnik 2019; Congress, 1-4, 2019 | | 2019 |
Marco RossiHuber+SuhnerVerified email at hubersuhner.com
