| Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging SK Bhogaraju, F Conti, HR Kotadia, S Keim, U Tetzlaff, G Elger Journal of Alloys and Compounds 844, 156043, 2020 | 39 | 2020 |
| Die-attach bonding for high temperature applications using thermal decomposition of copper (II) formate with polyethylene glycol SK Bhogaraju, O Mokhtari, F Conti, G Elger Scripta Materialia 182, 74-80, 2020 | 30 | 2020 |
| Process development and reliability of sintered high power chip size packages and flip chip LEDs A Hanss, M Schmid, SK Bhogaraju, F Conti, G Elger 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 26 | 2018 |
| Comparison of nondestructive testing methods for solder, sinter, and adhesive interconnects in power and opto-electronics M Schmid, SK Bhogaraju, E Liu, G Elger Applied Sciences 10 (23), 8516, 2020 | 21 | 2020 |
| Evaluation of silver and copper sintering of first level interconnects for high power LEDs SK Bhogaraju, A Hanß, M Schmid, G Elger, F Conti 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-8, 2018 | 21 | 2018 |
| Reliability of sintered and soldered high power chip size packages and flip chip LEDs A Hanss, M Schmid, SK Bhogaraju, F Conti, G Elger 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2080-2088, 2018 | 21 | 2018 |
| Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor F Conti, A Hanss, O Mokhtari, SK Bhogaraju, G Elger New Journal of Chemistry 42 (23), 19232-19236, 2018 | 18 | 2018 |
| Die-Attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging SK Bhogaraju, H R. Kotadia, F Conti, A Mauser, T Rubenbauer, ... ACS Applied Electronic Materials 3 (10), 4587-4603, 2021 | 14 | 2021 |
| A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition M Schmid, SK Bhogaraju, A Hanss, G Elger IEEE Transactions on Instrumentation and Measurement 70, 1-9, 2020 | 13 | 2020 |
| Thermomechanical stress in GaN LED soldered on copper substrate evaluated by Raman measurements and computer modelling R Signorini, D Pedron, F Conti, A Hanss, SK Bhogaraju, G Elger 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 12 | 2018 |
| Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy E Liu, F Conti, SK Bhogaraju, R Signorini, D Pedron, B Wunderle, G Elger Journal of Raman Spectroscopy 51 (10), 2083-2094, 2020 | 11 | 2020 |
| Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor O Mokhtari, F Conti, SK Bhogaraju, M Meier, H Schweigart, U Tetzlaff, ... New Journal of Chemistry 43 (26), 10227-10231, 2019 | 9 | 2019 |
| Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders SK Bhogaraju, F Conti, G Elger 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-7, 2020 | 8 | 2020 |
| Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging SK Bhogaraju, O Mokhtari, J Pascucci, A Hanss, M Schmid, F Conti, ... 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 7 | 2019 |
| A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization SK Bhogaraju, O Mokhtari, J Pascucci, F Conti, HR Kotadia, G Elger International Symposium on Microelectronics 2019 (1), 000387-000392, 2019 | 6 | 2019 |
| Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition M Schmid, A Hanss, SK Bhogaraju, G Elger 2019 25th International Workshop on Thermal Investigations of ICs and …, 2019 | 6 | 2019 |
| Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates F Conti, K Lux, SK Bhogaraju, E Liu, C Lenz, R Seitz, G Elger Optical Sensors 2021 11772, 302-311, 2021 | 5 | 2021 |
| Improved sinterability of particles to substrates by surface modifications on substrate metallization SK Bhogaraju, O Mokhtari, J Pascucci, F Conti, G Elger Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (HiTen …, 2019 | 5 | 2019 |
| Modelling thermo-mechanical stress in GaN-LEDs soldered on copper substrate with simulations validated by Raman experiments E Liu, F Conti, R Signorini, E Brugnolotto, SK Bhogaraju, G Elger 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 5 | 2019 |
| Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste SK Bhogaraju, M Schmid, E Hufnagel, F Conti, HR Kotadia, G Elger 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 526-531, 2021 | 4 | 2021 |
