| Thermally stable Cu3Sn/Cu composite joint for high-temperature power device X Liu, S He, H Nishikawa Scripta Materialia 110, 101-104, 2016 | 93 | 2016 |
| Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach X Liu, S He, H Nishikawa Journal of Alloys and Compounds 695, 2165-2172, 2017 | 60 | 2017 |
| Effect of substrates on fracture mechanism and process optimization of oxidation–reduction bonding with copper microparticles R Gao, S He, YA Shen, H Nishikawa Journal of Electronic Materials 48, 2263-2271, 2019 | 25 | 2019 |
| Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding R Gao, S He, J Li, YA Shen, H Nishikawa Journal of Materials Science: Materials in Electronics 31, 14635-14644, 2020 | 21 | 2020 |
| In-situ observation of fluxless soldering of Sn-3.0 Ag-0.5 Cu/Cu under a formic acid atmosphere S He, R Gao, J Li, YA Shen, H Nishikawa Materials Chemistry and Physics 239, 122309, 2020 | 21 | 2020 |
| Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints Z Jin, YA Shen, S He, S Zhou, YC Chan, H Nishikawa Journal of Applied Physics 126 (18), 2019 | 18 | 2019 |
| Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy D Le Han, YA Shen, S He, H Nishikawa Materials Science and Engineering: A 804, 140785, 2021 | 17 | 2021 |
| Wettability, interfacial reactions, and impact strength of Sn–3.0 Ag–0.5 Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere S He, R Gao, YA Shen, J Li, H Nishikawa Journal of materials science 55, 3107-3117, 2020 | 17 | 2020 |
| Behavior of Sn-3.0 Ag-0.5 Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere S He, YA Shen, B Xiong, F Huo, J Li, J Ge, Z Pan, W Li, C Hu, ... Journal of Materials Research and Technology 21, 2352-2361, 2022 | 14 | 2022 |
| Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder YA Shen, CM Lin, J Li, S He, H Nishikawa Scientific Reports 9 (1), 3658, 2019 | 14 | 2019 |
| Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere S He, H Nishikawa 2017 International Conference on Electronics Packaging (ICEP), 381-385, 2017 | 13 | 2017 |
| Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method F Huo, YA Shen, S He, K Zhang, H Nishikawa Vacuum 191, 110370, 2021 | 10 | 2021 |
| Molecular dynamics simulation of sintering densification of multi-scale silver layer P Liang, Z Pan, L Tang, G Zhang, D Yang, S He, H Yan Materials 15 (6), 2232, 2022 | 9 | 2022 |
| ICME framework for damage assessment and remaining creep life prediction of in-service turbine blades manufactured with Ni-based superalloys C Fu, Y Chen, S He, S Antonov, L Li, W Zheng, Q Feng Integrating Materials and Manufacturing Innovation 8, 509-520, 2019 | 8 | 2019 |
| Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density X Li, J Wang, H Qin, S He, W Li, S Wei Journal of Materials Science: Materials in Electronics 33 (20), 16167-16182, 2022 | 6 | 2022 |
| Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration R Gao, YA Shen, J Li, S He, H Nishikawa Journal of Materials Science: Materials in Electronics 31, 21711-21722, 2020 | 6 | 2020 |
| Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate S Zhou, S He, H Nishikawa Journal of Nanoscience and Nanotechnology 20 (1), 106-112, 2020 | 6 | 2020 |
| Effect of thermal aging on the impact strength of soldered bumps under formic acid atmosphere H Siliang, N Hiroshi 溶接学会論文集 35 (2), 127s-131s, 2017 | 6 | 2017 |
| Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere B Xiong, S He, J Ge, Q Li, C Hu, H Yan, YA Shen Soldering & Surface Mount Technology 36 (1), 39-50, 2024 | 5 | 2024 |
| Low-temperature transient liquid phase bonding technology via Cu porous-Sn58Bi solid–liquid system under formic acid atmosphere S He, B Xiong, F Xu, B Chen, Y Cui, C Hu, G Yue, YA Shen Materials 16 (6), 2389, 2023 | 5 | 2023 |
Yu-An ShenFeng Chia UniversityVerified email at fcu.edu.tw
