| A balunless frequency multiplier with differential output by current flow manipulation CH Li, WM Wu IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (7 …, 2018 | 16 | 2018 |
| Design and analysis of a 28 GHz T/R front-end module in 22-nm FD-SOI CMOS technology X Tang, Y Liu, G Mangraviti, Z Zong, K Khalaf, Y Zhang, WM Wu, SH Chen, ... IEEE Transactions on Microwave Theory and Techniques 69 (6), 2841-2853, 2021 | 15 | 2021 |
| A 28 GHz front-end module with T/R switch achieving 17.2 dBm Psat, 21.5% PAEmax and 3.2 dB NF in 22 nm FD-SOI for 5G communication Y Liu, X Tang, G Mangraviti, K Khalaf, Y Zhang, WM Wu, SH Chen, ... 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 347-350, 2020 | 10 | 2020 |
| Rf/high-speed i/o esd protection: Co-optimizing strategy between beol capacitance and hbm immunity in advanced cmos process WM Wu, MD Ker, SH Chen, JT Chen, D Linten, G Groeseneken IEEE Transactions on Electron Devices 67 (7), 2752-2759, 2020 | 8 | 2020 |
| ESD HBM discharge model in RF GaN-on-Si (MIS) HEMTs WM Wu, SH Chen, A Sibaja-Hernandez, S Yadav, U Peralagu, H Yu, ... 2021 IEEE International Electron Devices Meeting (IEDM), 39.5. 1-39.5. 4, 2021 | 6 | 2021 |
| ESD failures of GaN-on-Si D-mode AlGaN/GaN MIS-HEMT and HEMT devices for 5G telecommunications WM Wu, SH Chen, V Putcha, U Peralagu, A Sibaja-Hernandez, S Yadav, ... 2021 43rd Annual EOS/ESD Symposium (EOS/ESD) 43, 1-7, 2021 | 5 | 2021 |
| Low-Impedance Contact CDM–Evaluation and Modeling M Simicic, WM Wu, SH Chen, N Jack, S Tamura, Y Shimada, M Sawada, ... 2019 41st Annual EOS/ESD Symposium (EOS/ESD), 1-9, 2019 | 4 | 2019 |
| Comprehensive Investigations of HBM ESD Robustness for GaN-on-Si RF HEMTs S Abhinay, WM Wu, CA Shih, SH Chen, A Sibaja-Hernandez, B Parvais, ... 2022 International Electron Devices Meeting (IEDM), 30.7. 1-30.7. 4, 2022 | 3 | 2022 |
| ESD Protection Diodes in Sub-5nm Gate-All-Around Nanosheet Technologies SH Chen, A Veloso, H Mertens, G Hellings, M Simicic, WC Chen, WM Wu, ... 2020 42nd Annual EOS/ESD Symposium (EOS/ESD), 1-8, 2020 | 3 | 2020 |
| A low-cost DC-to-92 GHz broadband three-path bondwire interconnect WM Wu, MC Yu, CH Li, CN Kuo 2015 IEEE International Symposium on Radio-Frequency Integration Technology …, 2015 | 3 | 2015 |
| Wafer-Level LICCDM Device Testing M Simicic, WM Wu, D Claes, S Tamura, Y Shimada, M Sawada, SH Chen 2021 43rd Annual EOS/ESD Symposium (EOS/ESD) 43, 1-8, 2021 | 2 | 2021 |
| CMOS devices and circuits for THz applications CH Li, TY Chiu, WM Wu 2018 Asia-Pacific Microwave Conference (APMC), 1151-1153, 2018 | 1 | 2018 |
| Method for discharging static electricity WM Wu, MD Ker, CY Lin, LW Chu US Patent App. 18/403,685, 2024 | | 2024 |
| Integrated circuits including coil circuit and SCR W Wu, M Ker, C Lin, L Chu US Patent 11,901,353, 2024 | | 2024 |
| ON-state Human Body Model ESD Failure Mechanisms in GaN-on-Si RF MIS-HEMTs WM Wu, SH Chen, CA Shih, B Parvais, N Collaert, MD Ker, TL Wu, ... IEEE Electron Device Letters, 2023 | | 2023 |
| RF ESD Exploration in Si/III-V Heterogeneous Integration for 5G/B5G Applications WM Wu | | 2022 |
| Comprehensive Investigations of HBM ESD Robustness for GaN-on-Si RF HEMTs A Sandupatla, WM Wu, CA Shih, SH Chen, A Sibaja-Hernandez, ... IEEE, 2022 | | 2022 |
| Calibration and modeling of LICCDM setups M Simicic, WM Wu, S Tamura, Y Shimada, M Sawada, SH Chen | | 2021 |
| Interconnect Capacitance Investigation and Optimization Under I/O Pad for ESD Protection of RF/High Speed Circuits in Micro-& Nano-scale CMOS Technology WM Wu, JT Chen, SH Chen, MD Ker, D Linten, G Groeseneken | | 2020 |
