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Co-authors
- J. Joshua YangUniversity of Southern California, Professor ECE, IEEE Fellow / NAI FellowVerified email at usc.edu
- Zhongrui WangThe University of Hong KongVerified email at eee.hku.hk
- Rivu MidyaSandia National LaboratoriesVerified email at sandia.gov
- Shiva AsapuPhD scholar in Electrical and Computer Engineering, University of Massachusetts at AmherstVerified email at umass.edu
- Hao JiangMicron Technology Emerging Memory EngineerVerified email at micron.com
- Can LiThe University of Hong KongVerified email at hku.hk
- Saumil JoshiUniversity of Massachusetts, AmherstVerified email at umass.edu
- Jung Ho YoonAssistant Professor at Sungkyunkwan UniversityVerified email at skku.edu
- R. Stanley WilliamsTexas A & M University ECE DepartmentVerified email at rstanleywilliams.com
- Xumeng ZhangFrontier Institute of Chip and System, Fudan UniversityVerified email at fudan.edu.cn
- Miaofang ChiCenter for Nanophase Materials Sciences, Oak Ridge National LabVerified email at ornl.gov