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- Daniele IelminiProfessor of ElectronicsVerified email at elet.polimi.it
- Elia AmbrosiTSMCVerified email at tsmc.com
- Guangwei XuUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Erika CoviZernike Institute for Advanced Materials & CogniGron Center, University of GroningenVerified email at rug.nl
- Alessandro BricalliPolitecnico di MilanoVerified email at polimi.it
- Giacomo PedrettiResearch Scientist, Hewlett Packard LaboratoriesVerified email at hpe.com
- Yang LiPeng Cheng LaboratoryVerified email at pcl.ac.cn
- Dr. Lingfei WangProfessor,Researcher, Institute of Microelectronics, Chinese Academy of Sciences, ChinaVerified email at ime.ac.cn
- Zhong SunPeking UniversityVerified email at pku.edu.cn
- Ming WangAssociate Professor, Fudan UniversityVerified email at fudan.edu.cn
- Yu-Hsuan LinMacronix International Co., LTD.Verified email at nctu.edu.tw
- Mario LaudatoWestern DigitalVerified email at wdc.com
- Valerio MiloApplied MaterialsVerified email at amat.com
- Shahar KvatinskyTechnion - Israel Institute of TechnologyVerified email at ee.technion.ac.il
- Xumeng ZhangFrontier Institute of Chip and System, Fudan UniversityVerified email at fudan.edu.cn
- Matteo FarronatoPostdoctoral researcher, Politecnico di MilanoVerified email at polimi.it
- Xiaodong Chen(陈晓东)President's Chair Professor in Materials Science and Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Roberto CarboniIntel CorporationVerified email at intel.com
- Zhongrui WangThe University of Hong KongVerified email at eee.hku.hk
- Linfeng SUNProfessor, Beijing Institute of TechnologyVerified email at bit.edu.cn