| Self-healing of Interconnect Cracks for Reliable and Defect-Free Smart Manufacturing of Flexible Packages AY Hassan, R Banerjee, A Tomitaka, PM Raj 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1556-1561, 2022 | 1 | 2022 |
| Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications A Hassan, S Soroushiani, A Abdal, SYB Sayeed, WC Lin, MR Pulugurtha IEEE Open Journal of Nanotechnology 3, 52-60, 2022 | 1 | 2022 |
| Recent advances in implantable medical systems with highly-heterogeneous integration A Abdal, A Hassan, PM Raj ADVANCING MICROELECTRONICS MAGAZINE 47 (6), 12-21, 2021 | 1 | 2021 |
| Low-Frequency Power Telemetry Using Multiferroic Laminate Heterostructures V Jaiswal, P Gaire, S Bhardwaj, AY Hassan, JL Volakis, PM Raj 2023 Fourth International Symposium on 3D Power Electronics Integration and …, 2023 | | 2023 |
| 2022 Index IEEE Open Journal of Nanotechnology Vol. 3 A Abdal, L Bai, AA Balandin, F Bashir, HA Bhat, R Bhat, N Bindal, ... | | |
