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William Alan DoolittleGeorgia Institute of TechnologyVerified email at ece.gatech.edu
Zachary EngelGeorgia Institute of TechnologyVerified email at gatech.edu
Patrick E. HopkinsUniversity of VirginiaVerified email at virginia.edu
Yee Rui KohASMLVerified email at purdue.edu
Jingjing ShiUniversity of FloridaVerified email at ufl.edu
Samuel GrahamUniversity of MarylandVerified email at umd.edu
M. GoorskyUniversity of California, Los AngelesVerified email at seas.ucla.edu
Zhiting TianAssociate Professor, Cornell University; Ph.D., Massachusetts Institute of TechnologyVerified email at cornell.edu
Tengfei LuoDorini Family Professor, MÖNSTER (MOlecular/Nano-Sacle Transport & Energy Research) LabVerified email at nd.edu
David Hans OlsonVice President of Product Development, Laser ThermalVerified email at laserthermal.com
Renjiu HuCornell UniversityVerified email at cornell.edu
Kiumars AryanaNASAVerified email at nasa.gov
YEKAN WANGIntel CorpVerified email at g.ucla.edu
Luke YatesGeorgia Institute of TechnologyVerified email at gatech.edu
Tingyu BaiUniversity of California, Los AngelesVerified email at ucla.edu
Md Shafkat Bin HoqueUniversity of VirginiaVerified email at virginia.edu
Baiwei WangProcess Engineer, Applied MaterialsVerified email at amat.com
Daniel GallProfessor, Materials Science and Engineering, Rensselaer Polytechnic InstituteVerified email at rpi.edu
Erik MilosevicRensselaer Polytechnic InstituteVerified email at rpi.edu
John T. GaskinsCEO, Laser ThermalVerified email at laserthermal.com