| Low-temperature copper bonding strategy with graphene interlayer H Wang, WS Leong, F Hu, L Ju, C Su, Y Guo, J Li, M Li, A Hu, J Kong ACS nano 12 (3), 2395-2402, 2018 | 53 | 2018 |
| 3D hierarchical nanostructured Ni–Co alloy electrodes on porous nickel for hydrogen evolution reaction X Zhang, Y Li, Y Guo, A Hu, M Li, T Hang, H Ling International Journal of Hydrogen Energy 44 (57), 29946-29955, 2019 | 46 | 2019 |
| Formation mechanism of novel sidewall intermetallic compounds in micron level Sn/Ni/Cu bumps S Ren, M Sun, Z Jin, Y Guo, H Ling, A Hu, M Li Electronic Materials Letters 15, 562-571, 2019 | 17 | 2019 |
| Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation S Ren, Y Guo, L Ju, H Xiao, A Hu, M Li Journal of materials science 54, 7922-7930, 2019 | 9 | 2019 |
| Influence of intercolony boundary on corrosion behavior of electrodeposited Ni–W alloy for electronic connector applications X Long, T Hang, Y Guo, Y Li, Y Wu, H Ling, A Hu, M Li Materials Chemistry and Physics 239, 121989, 2020 | 8 | 2020 |
| Interfacial morphology evolution of a novel room-temperature ultrasonic bonding method based on nanocone arrays H Wang, L Ju, Y Guo, X Mo, S Ma, A Hu, M Li Applied Surface Science 324, 849-853, 2015 | 8 | 2015 |
| A facile and novel method to retard intermetallic compounds formation by inserting Cu3Sn interlayer S Ren, Y Guo, W Kang, T Hang, A Hu, M Li Materials Research Express 6 (9), 096313, 2019 | 5 | 2019 |
| Investigation on solid state bonding and intermetallic compounds reaction of Cu pillar bump/Ni micro cones Y Guo, A Hu, M Li 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 2 | 2018 |
