Status and review of two-dimensional carrier and dopant profiling using scanning probe microscopy P De Wolf, R Stephenson, T Trenkler, T Clarysse, T Hantschel, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2000 | 233 | 2000 |
Highly conductive diamond probes for scanning spreading resistance microscopy T Hantschel, P Niedermann, T Trenkler, W Vandervorst Applied Physics Letters 76 (12), 1603-1605, 2000 | 125 | 2000 |
Two-dimensional carrier profiling of InP structures using scanning spreading resistance microscopy P De Wolf, M Geva, T Hantschel, W Vandervorst, RB Bylsma Applied physics letters 73 (15), 2155-2157, 1998 | 99 | 1998 |
Heterojunction photovoltaic cell T Hantschel, K Littau, S Elrod US Patent App. 11/017,380, 2006 | 96* | 2006 |
Evaluating probes for “electrical” atomic force microscopy T Trenkler, T Hantschel, R Stephenson, P De Wolf, W Vandervorst, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2000 | 89 | 2000 |
Extrusion/dispensing systems and methods DK Fork, T Hantschel US Patent 7,765,949, 2010 | 77 | 2010 |
Silica gel solid nanocomposite electrolytes with interfacial conductivity promotion exceeding the bulk Li-ion conductivity of the ionic liquid electrolyte filler X Chen, B Put, A Sagara, K Gandrud, M Murata, JA Steele, H Yabe, ... Science Advances 6 (2), eaav3400, 2020 | 74 | 2020 |
Conductive diamond tips with sub‐nanometer electrical resolution for characterization of nanoelectronics device structures T Hantschel, C Demeulemeester, P Eyben, V Schulz, O Richard, ... physica status solidi (a) 206 (9), 2077-2081, 2009 | 68 | 2009 |
Probe tip configuration and a method of fabrication thereof T Hantschel, W Vandervorst US Patent 6,504,152, 2003 | 68 | 2003 |
Laser-induced periodic surface structures (LIPSS) on heavily boron-doped diamond for electrode applications AF Sartori, S Orlando, A Bellucci, DM Trucchi, S Abrahami, T Boehme, ... ACS applied materials & interfaces 10 (49), 43236-43251, 2018 | 64 | 2018 |
Extruding/dispensing multiple materials to form high-aspect ratio extruded structures DK Fork, T Hantschel US Patent 7,799,371, 2010 | 64 | 2010 |
Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts X Ke, S Bals, D Cott, T Hantschel, H Bender, G Van Tendeloo Microscopy and Microanalysis 16 (2), 210-217, 2010 | 63 | 2010 |
Evaluation of the electrical contact area in contact-mode scanning probe microscopy U Celano, T Hantschel, G Giammaria, RC Chintala, T Conard, H Bender, ... Journal of Applied Physics 117 (21), 2015 | 62 | 2015 |
Scanning probe system with spring probe and actuation/sensing structure T Hantschel, EM Chow, DK Fork, MA Rosa, D De Bruyker US Patent 6,734,425, 2004 | 62 | 2004 |
Probe and method of manufacturing mounted AFM probes T Hantschel, W Vandervorst US Patent 6,690,008, 2004 | 59 | 2004 |
J-springs-innovative compliant interconnects for next-generation packaging L Ma, Q Zhu, T Hantschel, DK Fork, SK Sitaraman 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 53 | 2002 |
Carbon nanotube growth for through silicon via application R Xie, C Zhang, MH Van der Veen, K Arstila, T Hantschel, B Chen, ... Nanotechnology 24 (12), 125603, 2013 | 52 | 2013 |
Observation of diameter dependent carrier distribution in nanowire-based transistors A Schulze, T Hantschel, P Eyben, AS Verhulst, R Rooyackers, ... Nanotechnology 22 (18), 185701, 2011 | 51 | 2011 |
Analysis and modeling of the high vacuum scanning spreading resistance microscopy nanocontact on silicon P Eyben, F Clemente, K Vanstreels, G Pourtois, T Clarysse, E Duriau, ... Journal of Vacuum Science & Technology B 28 (2), 401-406, 2010 | 51 | 2010 |
Electrical tomography using atomic force microscopy and its application towards carbon nanotube-based interconnects A Schulze, T Hantschel, A Dathe, P Eyben, X Ke, W Vandervorst Nanotechnology 23 (30), 305707, 2012 | 49 | 2012 |