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Co-authors
Seong H. KimDepartment of Chemical Engineering, Materials Research Institute, Pennsylvania State UniversityVerified email at engr.psu.edu- Ashlie MartiniUniversity of California MercedVerified email at ucmerced.edu
- Fakhrul Hasan BhuiyanGraduate Student Researcher at University of California MercedVerified email at ucmerced.edu
- Seokhoon JangDepartment of Chemical Engineering, Penn StateVerified email at psu.edu
- Yip-Wah ChungNorthwestern UniversityVerified email at northwestern.edu
- Arman KhanPhD Candidate in Mechanical Engineering, Northwestern UniversityVerified email at u.northwestern.edu
- Andy OgrincThe Pennsylvania State UniversityVerified email at psu.edu
- Q. Jane WangProfessor, Mechanical Engineering, Northwestern UniversityVerified email at northwestern.edu
- Christian W. PesterUniversity of DelawareVerified email at udel.edu
- Huseyin KayaCorning Inc.Verified email at psu.edu
- Yen-Ting LinAdvanced Semiconductor Materials (ASM); Pennsylvania State UniversityVerified email at asm.com
