| Hybrid microchannel/multi-jet two-phase heat sink: A benchmark and geometry optimization study of commercial product CH Hoang, S Rangarajan, S Khalili, B Ramakrisnan, V Radmard, ... International Journal of Heat and Mass Transfer 169, 120920, 2021 | 45 | 2021 |
| Multi-objective optimization of a chip-attached micro pin fin liquid cooling system V Radmard, Y Hadad, S Rangarajan, CH Hoang, N Fallahtafti, CL Arvin, ... Applied Thermal Engineering 195, 117187, 2021 | 44 | 2021 |
| Performance analysis and shape optimization of an impingement microchannel cold plate Y Hadad, N Fallahtafti, L Choobineh, CH Hoang, V Radmard, PR Chiarot, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 42 | 2020 |
| An experimental apparatus for two-phase cooling of high heat flux application using an impinging cold plate and dielectric coolant CH Hoang, S Khalili, B Ramakrisnan, S Rangarajan, Y Hadad, ... 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 24 | 2020 |
| Minimizing the effects of on-chip hotspots using multi-objective optimization of flow distribution in water-cooled parallel microchannel heatsinks Y Hadad, V Radmard, S Rangarajan, M Farahikia, G Refai-Ahmed, ... Journal of Electronic Packaging 143 (2), 021007, 2021 | 22 | 2021 |
| Direct micro-pin jet impingement cooling for high heat flux applications V Radmard, Y Hadad, A Azizi, S Rangarajan, CH Hoang, C Arvin, K Sikka, ... 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 18 | 2020 |
| Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications N Fallahtafti, S Rangarajan, Y Hadad, C Arvin, K Sikka, CH Hoang, ... International Journal of Heat and Mass Transfer 192, 122897, 2022 | 13 | 2022 |
| Performance Analysis of Impinging Chip-Attached Micro Pin Fin Direct Liquid Cooling Package for Hotspot Targeted Applications V Radmard, A Azizi, S Rangarajan, N Fallahtafti, CH Hoang, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 13 | 2021 |
| Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, S Saini, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 8 | 2022 |
| Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy et al." A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low … A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury International Electronic Packaging Technical Conference and Exhibition 86557 …, 0 | 8 | |
| Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model A Ortega, C Caceres, U Uras, D Kisitu, U Chowdhury, V Radmard, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 5 | 2022 |
| Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, A Sivakumar, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 4 | 2022 |
| Design and thermal analysis of a 3-D printed impingement pin fin cold plate for heterogeneous integration application CH Hoang, A Azizi, N Fallahtafti, S Rangarajan, V Radmard, C Arvin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 4 | 2022 |
| Effects of Different Coolants on the Cooling Performance of an Impingement Microchannel Cold Plate CH Hoang, G Mohsenian, N Fallatafti, V Radmard, S Rangarajan, C Arvin, ... 2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2021 | 4 | 2021 |
| Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate V Radmard, AR Gharaibeh, MI Tradat, CH Hoang, YY Manaserh, ... Journal of Electronic Packaging 145 (2), 021001, 2023 | 3 | 2023 |
| Measuring the Surface Flatness of Heaters and Cold plates and Estimating its Effect on Heat Transfer A Heydari, N Fallahtafti, M Tradat, V Radmard, Q Al-Soud, U Chowdhury, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 3 | 2023 |
| Guidelines and Experimental Hydraulic performance Evaluation for Single-Phase CDUs Under Steady and Transient Events A Heydari, AR Gharaibeh, M Tradat, Y Manaserh, Q Soud, V Radmard, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 3 | 2023 |
| A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, C Hinge, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 3 | 2022 |
| A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification G Mohsenian, CH Hoang, K Nemati, H Alissa, M Tradat, N Fallahtafti, ... Journal of Electronic Packaging 144 (4), 041015, 2022 | 2 | 2022 |
| Two-Phase Impingement Cooling Using a Trapezoidal Groove Microchannel Heat Sink and Dielectric Coolant HFE 7000 CH Hoang, S Rangarajan, V Radmard, N Fallahtafti, M Tradat, C Arvin, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 2 | 2021 |
Bahgat G SammakiaBinghamton UniversityVerified email at binghamton.edu
