| Electron backscatter diffraction in materials science AJ Schwartz, M Kumar, BL Adams, DP Field Springer, 2009 | 2025 | 2009 |
| An experimental investigation into additive manufacturing-induced residual stresses in 316L stainless steel AS Wu, DW Brown, M Kumar, GF Gallegos, WE King Metallurgical and Materials Transactions A 45 (13), 6260-6270, 2014 | 556 | 2014 |
| Probing the active surface sites for CO reduction on oxide-derived copper electrocatalysts A Verdaguer-Casadevall, CW Li, TP Johansson, SB Scott, JT McKeown, ... Journal of the American Chemical Society 137 (31), 9808-9811, 2015 | 501 | 2015 |
| Grain-boundary engineering markedly reduces susceptibility to intergranular hydrogen embrittlement in metallic materials S Bechtle, M Kumar, BP Somerday, ME Launey, RO Ritchie Acta materialia 57 (14), 4148-4157, 2009 | 394 | 2009 |
| Analysis of grain boundary networks and their evolution during grain boundary engineering CA Schuh, M Kumar, WE King Acta Materialia 51 (3), 687-700, 2003 | 333 | 2003 |
| Modifications to the microstructural topology in fcc materials through thermomechanical processing M Kumar, WE King, AJ Schwartz Acta Materialia 48 (9), 2081-2091, 2000 | 323 | 2000 |
| Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials M Kumar, AJ Schwartz, WE King Acta materialia 50 (10), 2599-2612, 2002 | 274 | 2002 |
| Grain boundary energy function for fcc metals VV Bulatov, BW Reed, M Kumar Acta Materialia 65, 161-175, 2014 | 220 | 2014 |
| Analysis of local orientation gradients in deformed single crystals DP Field, PB Trivedi, SI Wright, M Kumar Ultramicroscopy 103 (1), 33-39, 2005 | 213 | 2005 |
| Effect of microstructural length scales on spall behavior of copper RW Minich, JU Cazamias, M Kumar, AJ Schwartz Metallurgical and Materials Transactions A 35, 2663-2673, 2004 | 190 | 2004 |
| High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering Y Gao, M Kumar, RK Nalla, RO Ritchie Metallurgical and Materials Transactions A 36 (12), 3325-3333, 2005 | 152 | 2005 |
| Connectivity and percolation in simulated grain-boundary networks CA Schuh, RW Minich, M Kumar Philosophical Magazine 83 (6), 711-726, 2003 | 136 | 2003 |
| Present state of electron backscatter diffraction and prospective developments RA Schwarzer, DP Field, BL Adams, M Kumar, AJ Schwartz Electron backscatter diffraction in materials science, 1-20, 2009 | 135 | 2009 |
| Atomistic modeling of shock-induced void collapse in copper LP Davila, P Erhart, EM Bringa, MA Meyers, VA Lubarda, MS Schneider, ... Applied Physics Letters 86 (16), 161902, 2005 | 119 | 2005 |
| Materials science under extreme conditions of pressure and strain rate BA Remington, G Bazan, J Belak, E Bringa, JD Colvin, MJ Edwards, ... Metallurgical and Materials Transactions A 35, 2587-2607, 2004 | 109 | 2004 |
| High-cycle fatigue of nickel-base superalloy René 104 (ME3): Interaction of microstructurally small cracks with grain boundaries of known character Y Gao, JS Stölken, M Kumar, RO Ritchie Acta materialia 55 (9), 3155-3167, 2007 | 104 | 2007 |
| Universal features of grain boundary networks in FCC materials CA Schuh, M Kumar, WE King Journal of materials science 40, 847-852, 2005 | 85 | 2005 |
| Mathematical methods for analyzing highly-twinned grain boundary networks BW Reed, M Kumar Scripta materialia 54 (6), 1029-1033, 2006 | 76 | 2006 |
| Atomistic mechanism of shock-induced void collapse in nanoporous metals P Erhart, EM Bringa, M Kumar, K Albe Physical Review B 72 (5), 052104, 2005 | 73 | 2005 |
| Ordering reactions in an Ni 25Mo 8Cr alloy M Kumar, VK Vasudevan Acta materialia 44 (4), 1591-1600, 1996 | 73 | 1996 |
Adam J SchwartzAmes Laboratory在 ameslab.gov 的电子邮件经过验证
