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Liancheng WangCollege of Mechanical and Electrical Engineering, Central South University, Changsha Hunan, ChinaVerified email at semi.ac.cn
Hongwei ZhuTsinghua UniversityVerified email at tsinghua.edu.cn
Manijeh RazeghiNorthwestern UniversityVerified email at eecs.northwestern.edu
Arash DehzangiAssistant Professor at Northwestern UniversityVerified email at northwestern.edu
Hongjian LiSolid State Lighting & Energy Electronics Center, UCSBVerified email at ucsb.edu
Panpan LiUniversity of California, Santa BarbaraVerified email at ucsb.edu
Hoi Wai ChoiProfessor, Electrical and Electronic Engineering, The University of Hong KongVerified email at hku.hk
Abbas HaddadiResearch Assistant Professor at Northwestern UniversityVerified email at u.northwestern.edu
Romain ChevallierNorthwestern UniversityVerified email at u.northwestern.edu
Lining LiuInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Zi-Hui ZhangProfessor, Hebei University of TechnologyVerified email at hebut.edu.cn
liu zhiqiangInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityVerified email at suda.edu.cn
Jian-An HuangAssistant Professor, Academy Research Fellow, and Group Leader, University of OuluVerified email at oulu.fi
Donghai WuInstitute of Semiconductor, CASVerified email at semi.ac.cn
Follow![Yiyun Zhang](https://scholar.googleusercontent.com/citations?view_op=view_photo&user=YxLX2rUAAAAJ&citpid=3)
Yiyun Zhang
Institute of Semiconcutors, Chinese Academy of Sciences
Verified email at semi.ac.cn