| Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing E Kim, J Lee, C Bae, H Seok, HU Kim, T Kim Powder Technology 397, 117025, 2022 | 38 | 2022 |
| Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction J Lee, E Kim, C Bae, H Seok, J Cho, K Aydin, T Kim Materials Science in Semiconductor Processing 159, 107349, 2023 | 16 | 2023 |
| Investigation of thermal effects in copper chemical mechanical polishing P Liu, S Bae, S Hong, C Bae, H Seo, J Lee, C Tang, T Kim Precision Engineering 73, 195-202, 2022 | 14 | 2022 |
| Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution D Kwak, J Kim, S Oh, C Bae, T Kim Review of Scientific Instruments 91 (7), 2020 | 6 | 2020 |
| Effect of ionic strength on amorphous carbon during chemical mechanical planarization S Oh, C Shin, D Kwak, E Kim, J Kim, C Bae, T Kim Diamond and Related Materials 127, 109124, 2022 | 3 | 2022 |
| Size distribution measurement of mixed abrasive slurry for chemical mechanical planarization using an electrospray scanning mobility particle sizer D Kwak, J Kim, S Oh, C Bae, T Kim Colloids and Surfaces A: Physicochemical and Engineering Aspects 674, 131798, 2023 | 2 | 2023 |
| Effect of radial grooves pads on copper chemical mechanical polishing C Bae, S Oh, J Kim, D Kwak, S Oh, T Kim Materials Science in Semiconductor Processing 151, 106968, 2022 | 2 | 2022 |
| Investigation of 2-way injection method on Cu CMP process J Kim, C Bae, D Kwak, S Oh, T Kim Electrochemical Society Meeting Abstracts 239, 809-809, 2021 | 1 | 2021 |
| Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol SJ Oh, SY Lee, H Kim, D Kwak, C Bae, TS Kim Solid State Phenomena 314, 23-28, 2021 | 1 | 2021 |
| Unlocking of Schottky Barrier Near the Junction of MoS2 Heterostructure Under Electrochemical Potential K Aydin, M Kim, H Seok, C Bae, J Lee, M Kim, J Park, JT Hupp, D Whang, ... Energy & Environmental Materials, e12800, 2024 | | 2024 |
| Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process C Bae, J Kim, D Kwak, S Oh, T Kim Applied Sciences 13 (6), 3758, 2023 | | 2023 |
| Slurry Temperature Effect on Copper CMP P Liu, SH Bae, S Hong, C Bae, T Kim 대한기계학회 춘추학술대회, 318-319, 2021 | | 2021 |
| Effect of Viscosity on Ceria Abrasive Removal in the Buffing CMP Process J Kim, S Hong, C Bae, Y Wada, H Hiyama, S Hamada, TS Kim Solid State Phenomena 314, 247-252, 2021 | | 2021 |
| Application of an Electrospray Scanning Mobility Particle Sizer to Mixed Abrasive Slurry for Chemical Mechanical Planarization D Kwak, J Kim, S Oh, C Bae, T Kim Available at SSRN 4207775, 0 | | |
