| Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008 | 532 | 2008 |
| Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation C Dietz, K Rykaczewski, AG Fedorov, Y Joshi Applied physics letters 97 (3), 2010 | 369 | 2010 |
| Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices X Wei, Y Joshi, MK Patterson | 279 | 2007 |
| Parametric numerical study of flow and heat transfer in microchannels with wavy walls L Gong, K Kota, W Tao, Y Joshi | 253 | 2011 |
| Single-phase liquid cooled microchannel heat sink for electronic packages HY Zhang, D Pinjala, TN Wong, KC Toh, YK Joshi Applied Thermal Engineering 25 (10), 1472-1487, 2005 | 253 | 2005 |
| Characterization of nanostructured thermal interface materials-A review AJ McNamara, Y Joshi, ZM Zhang TMNN-2011. Proceedings of the International Symposium on Thermal and …, 2011 | 247 | 2011 |
| Stacked microchannel heat sinks for liquid cooling of microelectronic components X Wei, Y Joshi J. Electron. Packag. 126 (1), 60-66, 2004 | 246 | 2004 |
| Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement S Launay, AG Fedorov, Y Joshi, A Cao, PM Ajayan Microelectronics Journal 37 (11), 1158-1164, 2006 | 223 | 2006 |
| Energy efficient thermal management of data centers Y Joshi, P Kumar Springer Science & Business Media, 2012 | 210 | 2012 |
| Thermal issues in next-generation integrated circuits SP Gurrum, SK Suman, YK Joshi, AG Fedorov IEEE Transactions on device and materials reliability 4 (4), 709-714, 2004 | 210 | 2004 |
| Optimization study of stacked micro-channel heat sinks for micro-electronic cooling X Wei, Y Joshi IEEE transactions on components and packaging technologies 26 (1), 55-61, 2003 | 203 | 2003 |
| Melting in a side heated tall enclosure by a uniformly dissipating heat source D Pal, YK Joshi International Journal of Heat and Mass Transfer 44 (2), 375-387, 2001 | 196 | 2001 |
| Modeling of data center airflow and heat transfer: State of the art and future trends J Rambo, Y Joshi Distributed and Parallel Databases 21, 193-225, 2007 | 190 | 2007 |
| VPM tokens: virtual machine-aware power budgeting in datacenters R Nathuji, K Schwan Proceedings of the 17th international symposium on High performance …, 2008 | 171 | 2008 |
| Thermodynamic analysis of an absorption refrigeration system with ionic-liquid/refrigerant mixture as a working fluid YJ Kim, S Kim, YK Joshi, AG Fedorov, PA Kohl Energy 44 (1), 1005-1016, 2012 | 166 | 2012 |
| Design and performance evaluation of a compact thermosyphon A Pal, YK Joshi, MH Beitelmal, CD Patel, TM Wenger IEEE Transactions on Components and Packaging Technologies 25 (4), 601-607, 2002 | 152 | 2002 |
| Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim | 146 | 2010 |
| High-speed visualization of boiling from an enhanced structure C Ramaswamy, Y Joshi, W Nakayama, WB Johnson International journal of heat and mass transfer 45 (24), 4761-4771, 2002 | 144 | 2002 |
| Review of thermal packaging technologies for automotive power electronics for traction purposes J Broughton, V Smet, RR Tummala, YK Joshi Journal of Electronic Packaging 140 (4), 040801, 2018 | 135 | 2018 |
| Effect of tip clearance on the thermal and hydrodynamic performance of a shrouded pin fin array KA Moores, YK Joshi J. Heat Transfer 125 (6), 999-1006, 2003 | 133 | 2003 |
