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Co-authors
- Xueqing LiAssociate Professor, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Dheeraj MohataSenior Integration Engineer, GCS IncVerified email at gcsincorp.com
- Jack SampsonAssociate Professor, Pennsylvania State UniversityVerified email at psu.edu
- Kaisheng MaInstitute for Interdisciplinary Information Sciences, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Ramesh VaddiSRM University Andhra PradeshVerified email at srmap.edu.in
- Karthik SwaminathanIBM Watson ResearchVerified email at us.ibm.com
- Himanshu MadanIntel, PennState UniversityVerified email at intel.com
- Nikhil ShuklaUniversity of VirginiaVerified email at virginia.edu
- Michael NiemierUniversity of Notre DameVerified email at nd.edu
- Nidhi AgrawalPrincipal Engineer - Western DigitalVerified email at wdc.com
- Mahsa ShoaranTenure-Track Assistant Professor, EPFL, SwitzerlandVerified email at epfl.ch
- Alexandre SchmidEPFLVerified email at epfl.ch
- Joseph J. NahasVisiting Professor, Department of Computer Science and Engineering, University of Notre DameVerified email at nd.edu
- Behnam SedighiSemiconductor IndustryVerified email at qti.qualcomm.com
- Ayan KarSynopsysVerified email at synopsys.com
- Eugene FreemanHoneywell AerospaceVerified email at honeywell.com
- Yuan XieChair Professor of Hong Kong University of Science and Technology (HKUST)Verified email at ust.hk
- Sumeet GuptaSchool of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Jian WangChinese University of Hong Kong (Shenzhen)Verified email at cuhk.edu.cn
- Bijesh RajamohananSanDisk