Adhesion quantification methods for wafer bonding Ö Vallin, K Jonsson, U Lindberg Materials Science and Engineering: R: Reports 50 (4-5), 109-165, 2005 | 151 | 2005 |
Inversion in metal–oxide–semiconductor capacitors on boron-doped diamond KK Kovi, Ö Vallin, S Majdi, J Isberg IEEE Electron Device Letters 36 (6), 603-605, 2015 | 32 | 2015 |
Quartz‐to‐Quartz Direct Bonding P Rangsten, Ö Vallin, K Hermansson, Y Bäcklund Journal of the Electrochemical Society 146 (3), 1104, 1999 | 24 | 1999 |
LDMOS-transistors on semi-insulating silicon-on-polycrystalline-silicon carbide substrates for improved RF and thermal properties S Lotfi, LG Li, Ö Vallin, L Vestling, H Norström, J Olsson Solid-State Electronics 70, 14-19, 2012 | 20 | 2012 |
Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process D Banerjee, Ö Vallin, KM Samani, S Majee, SL Zhang, J Liu, ZB Zhang Nano Energy 44, 89-94, 2018 | 18 | 2018 |
High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals NH Pham, Ö Vallin, J Panda, M Venkata Kamalakar, J Guo, J Luo, C Wen, ... Journal of Applied Physics 127 (24), 2020 | 11 | 2020 |
Direct bonded quartz resonators O Vallin, B Einefors, C Hedlund, G Thornell Proceedings of the 2001 IEEE International Frequncy Control Symposium and …, 2001 | 10 | 2001 |
Electrical properties of Ag/Ta and Ag/TaN thin-films S Mardani, D Primetzhofer, L Liljeholm, Ö Vallin, H Norström, J Olsson Microelectronic engineering 120, 257-261, 2014 | 7 | 2014 |
Oxygen out-diffusion from buried layers in SOI and SiC–SOI substrates LG Li, Ö Vallin, J Lu, U Smith, H Norström, J Olsson Solid-state electronics 54 (2), 153-157, 2010 | 7 | 2010 |
Polishing of quartz by rapid etching in ammonium bifluoride O Vallin, R Danielsson, U Lindberg, G Thornell IEEE transactions on ultrasonics, ferroelectrics, and frequency control 54 …, 2007 | 7 | 2007 |
Silicon fusion bond interfaces resilient to wet anisotropic etchants J Köhler, C Strandman, Ö Vallin, C Hedlund, Y Bäcklund Journal of Micromechanics and Microengineering 11 (4), 359, 2001 | 7 | 2001 |
Novel silicon-on-SiC substrate with superior thermal and RF performance J Olsson, O Vallin, G Sjoblom, H Norstrom, U Smith, L Vestling, S Berg 2007 IEEE International SOI Conference, 115-116, 2007 | 6 | 2007 |
High-temperature piezoresistive gauge fabricated on commercially available silicon-on-insulator wafers Ö Vallin, Y Bäcklund Journal of Micromechanics and Microengineering 10 (2), 196, 2000 | 6 | 2000 |
Dynamics of SiO2 Buried Layer Removal from Si-SiO2-Si and Si-SiO2-SiC Bonded Substrates by Annealing in Ar LG Li, S Rubino, Ö Vallin, J Olsson Journal of electronic materials 43, 541-547, 2014 | 5 | 2014 |
Hybrid Wafers S Berg, J Olsson, Ö Vallin, U Smith US Patent App. 12/298,336, 2009 | 5 | 2009 |
Strength of bonded interfaces Ö Vallin, K Jonsson, R Knechtel Handbook of Silicon Based MEMS Materials and Technologies, 823-832, 2020 | 4 | 2020 |
Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer S Mardani, Ö Vallin, JT Wätjen, H Norström, J Olsson, SL Zhang Applied Physics Letters 105 (7), 2014 | 4 | 2014 |
Thermal characterization of polycrystalline SiC LG Li, S Lotfi, Ö Vallin, J Olsson Journal of electronic materials 43, 1150-1153, 2014 | 4 | 2014 |
Fabrication and characterization of 150-mm silicon-on-polycrystalline silicon carbide substrates S Lotfi, LG Li, Ö Vallin, H Norström, J Olsson Journal of electronic materials 41, 480-487, 2012 | 4 | 2012 |
Buried aluminum nitride insulator for improving thermal conduction in SOI DM Martin, O Vallin, I Katardjiev, J Olsson 2008 IEEE International SOI Conference, 105-106, 2008 | 4 | 2008 |