| Method for ultra rapid determination of the lubrication mechanism in chemical mechanical planarization R Han, Y Sampurno, S Theng, F Sudargho, Y Zhuang, A Philipossian ECS Journal of Solid State Science and Technology 6 (1), P32, 2016 | 28 | 2016 |
| Effect of pad surface micro-texture on tribological, thermal and kinetic characterizations during copper chemical mechanical planarization R Han, Y Mu, Y Sampurno, Y Zhuang, A Philipossian ECS Journal of Solid State Science and Technology 6 (4), P201, 2017 | 24 | 2017 |
| Effect of CVD-coated diamond discs on pad surface micro-texture and polish performance in copper CMP C Stuffle, R Han, Y Sampurno, D Slutz, S Theng, L Borucki, A Philipossian ECS Journal of Solid State Science and Technology 7 (2), P9, 2018 | 22 | 2018 |
| Improvements in stribeck curves for copper and tungsten chemical mechanical planarization on soft pads M Bahr, Y Sampurno, R Han, A Philipossian ECS Journal of Solid State Science and Technology 6 (5), P290, 2017 | 20 | 2017 |
| Application of the Stribeck+ curve in silicon dioxide chemical mechanical planarization R Han, Y Sampurno, S Theng, F Sudargho, Y Zhuang, A Philipossian ECS Journal of Solid State Science and Technology 6 (4), P161, 2017 | 20 | 2017 |
| Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization Y Mu, R Han, Y Sampurno, Y Zhuang, A Philipossian ECS Journal of Solid State Science and Technology 5 (6), P345, 2016 | 18 | 2016 |
| Effect of Retaining Ring Slot Designs, Conditioning Discs and Conditioning Schemes on the Slurry Bow Wave Width during Chemical Mechanical Planarization LV Bengochea, Y Sampurno, C Stuffle, F Sudargho, R Han, ... ECS Journal of Solid State Science and Technology 7 (5), P253, 2018 | 12 | 2018 |
| Real-Time Shear and Normal Force Trends in Copper Chemical Mechanical Planarization with Different Conditioning Discs L Peckler, R Han, Y Sampurno, A Philipossian ECS Journal of Solid State Science and Technology 7 (3), P125, 2018 | 9 | 2018 |
| Fractional in situ pad conditioning in chemical mechanical planarization R Han, Y Sampurno, A Philipossian Tribology Letters 65, 1-6, 2017 | 9 | 2017 |
| Feasibility of a real-time method in determine the extent of pad break-in during copper chemical mechanical planarization R Han, Y Sampurno, A Philipossian Tribology Letters 62, 1-6, 2016 | 9 | 2016 |
| Slurry injection schemes on the extent of slurry mixing and availability during Chemical Mechanical Planarization M Bahr, Y Sampurno, R Han, A Philipossian Micromachines 8 (6), 170, 2017 | 8 | 2017 |
| Cobalt “Buff Step” Chemical Mechanical Planarization C Stuffle, R Han, Y Sampurno, S Theng, WT Tseng, A Philipossian ECS Journal of Solid State Science and Technology 7 (3), P114, 2018 | 7 | 2018 |
| Effect of Various Slurry Injection System Configurations on Removal Rates of Silicon Dioxide Using a Ceria-Based Chemical Mechanical Planarization Slurry R Han, Y Sampurno, M Bahr, M Skillman, L Borucki, A Philipossian ECS Journal of Solid State Science and Technology 6 (7), P449, 2017 | 7 | 2017 |
| First principles study on formation mechanism of anodization process of titanium M Mao, R Han, R Zhao, W Jiang, B Liang Protection of Metals and Physical Chemistry of Surfaces 52, 500-511, 2016 | 6 | 2016 |
| Mean residence time and dispersion number associated with slurry injection methods in chemical mechanical planarization Y Mu, R Han, Y Sampurno, Y Zhuang, L Borucki, A Philipossian ECS Journal of Solid State Science and Technology 5 (3), P155, 2015 | 6 | 2015 |
| Application of a Slurry Injection System to Cobalt “Buff Step” Chemical Mechanical Planarization C Stuffle, R Han, Y Sampurno, S Theng, WT Tseng, A Philipossian ECS Journal of Solid State Science and Technology 7 (4), P170, 2018 | 5 | 2018 |
| Effect of conditioning and slurry application method on silicon dioxide removal rates using a ceria-based chemical mechanical planarization slurry R Han, Y Sampurno, M Bahr, L Borucki, A Philipossian ECS Journal of Solid State Science and Technology 6 (7), P477, 2017 | 5 | 2017 |
| Method for accelerated diamond fracture characterization in chemical mechanical planarization R Han, X Wei, Y Zhuang, YA Sampurno, A Philipossian Microelectronic Engineering 149, 37-40, 2016 | 5 | 2016 |
| Visualizing Slurry Flow in Chemical Mechanical Planarization via High-Speed Videography LV Bengochea, Y Sampurno, C Stuffle, R Han, C Rogers, A Philipossian ECS Journal of Solid State Science and Technology 7 (3), P118, 2018 | 3 | 2018 |
| Effect of Slurry Injection System Position on Removal Rate for Shallow Trench Isolation Chemical Mechanical Planarization Using a Cerium Dioxide Slurry M Bahr, Y Sampurno, R Han, M Skillman, L Borucki, A Philipossian ECS Journal of Solid State Science and Technology 6 (7), P455, 2017 | 2 | 2017 |
