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Zonghui Su
Zonghui Su
Carnegie Mellon University; Applied Materials, Inc.
Verified email at andrew.cmu.edu
Title
Cited by
Cited by
Year
Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance
KT Regner, DP Sellan, Z Su, CH Amon, AJH McGaughey, JA Malen
Nature communications 4 (1), 1640, 2013
6642013
Layer-by-layer thermal conductivities of the Group III nitride films in blue/green light emitting diodes
Z Su, L Huang, F Liu, JP Freedman, LM Porter, RF Davis, JA Malen
Applied Physics Letters 100 (20), 2012
632012
The impact of film thickness and substrate surface roughness on the thermal resistance of aluminum nitride nucleation layers
Z Su, JP Freedman, JH Leach, EA Preble, RF Davis, JA Malen
Journal of Applied Physics 113 (21), 2013
492013
259 Gaughey, JA Malen, Broadband Phonon Mean Free Path Con-260 tributions to Thermal Conductivity Measured using Frequency 261 Domain Thermoreflectance
KT Regner, DP Sellan, Z Su, CH Amon, AJH Mc
Nature Comm 4 (1640), 1, 2013
92013
Broadband Phonon Mean Free Path Contributions to Thermal Conductivity to Thermal Conductivity Measured Using Frequency Domain Thermoreflectance
KT Regner, DP Sellan, Z Su, CH Amon, AJH McGaughey, JA Malen
Nat. Commun. 4, 1640, 2013
72013
Heat dissipation in GAN based power electronics
Z Su, JA Malen
ECS Transactions 58 (4), 343, 2013
42013
Temperature dependent thermal properties in LEDs for solid state lighting
Z Su, JA Malen, L Huang, RF Davis
International Conference on Micro/Nanoscale Heat Transfer 54778, 579-583, 2012
42012
Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch
Z Su, JA Malen, JP Freedman, RF Davis, JH Leach, EA Preble
Heat Transfer Summer Conference 55478, V001T03A004, 2013
32013
Heat Dissipation in GaN Based Power Electronics
JA Malen, Z Su
ECS Meeting Abstracts, 1941, 2013
2013
Thermal Transport in LEDs for Solid State Lighting
Z Su, JA Malen, JH Melby, RF Davis
ASME/JSME Thermal Engineering Joint Conference 38921, T30072, 2011
2011
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