| Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations JM Shah, R Eiland, A Siddarth, D Agonafer 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 68 | 2016 |
| Effect of relative humidity, temperature and gaseous and particulate contaminations on information technology equipment reliability P Singh, L Klein, D Agonafer, JM Shah, KD Pujara International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 37 | 2015 |
| Reliability Considerations for Oil Immersion-Cooled Data Centers JM Shah, R Eiland, P Rajmane, A Siddarth, D Agonafer, V Mulay Journal of Electronic Packaging 141 (2), 021007, 2019 | 35 | 2019 |
| Reliability challenges in airside economization and oil immersion cooling JM Shah | 35 | 2016 |
| Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time PV Bansode, JM Shah, G Gupta, D Agonafer, H Patel, D Roe, R Tufty Journal of Electronic Packaging, 2019 | 34 | 2019 |
| Air flow pattern and path flow simulation of airborne particulate contaminants in a high-density data center utilizing airside economization G Thirunavakkarasu, S Saini, J Shah, D Agonafer International electronic packaging technical conference and exhibition 51920 …, 2018 | 32 | 2018 |
| Development of a technique to measure deliquescent relative humidity of particulate contaminants and determination of the operating relative humidity of a data center JM Shah, R Anand, S Saini, R Cyriac, D Agonafer, P Singh, M Kaler International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 31 | 2019 |
| Experimental analysis for optimization of thermal performance of a server in single phase immersion cooling PA Shinde, PV Bansode, S Saini, R Kasukurthy, T Chauhan, JM Shah, ... IPACK2019-6590, 2019 | 31 | 2019 |
| Measurement of the thermal performance of a single-phase immersion cooled server at elevated temperatures for prolonged time PV Bansode, JM Shah, G Gupta, D Agonafer, H Patel, D Roe, R Tufty International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 25 | 2018 |
| Qualitative study of cumulative corrosion damage of information technology equipment in a data center utilizing air-side economizer operating in recommended and expanded ASHRAE … JM Shah, O Awe, B Gebrehiwot, D Agonafer, P Singh, N Kannan, M Kaler Journal of Electronic Packaging 139 (2), 020903, 2017 | 23 | 2017 |
| Design considerations relating to non-thermal aspects of oil immersion cooling JM Shah, SHI Rizvi, IS Kota, SR Nagilla, D Thakkar, D Agonafer ASME International Mechanical Engineering Congress and Exposition 50640 …, 2016 | 23 | 2016 |
| Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer JM Shah, O Awe, P Agarwal, I Akhigbe, D Agonafer, P Singh, N Kannan, ... ASME International Mechanical Engineering Congress and Exposition 50640 …, 2016 | 22 | 2016 |
| Computational analysis for thermal optimization of server for single phase immersion cooling D Gandhi, U Chowdhury, T Chauhan, P Bansode, S Saini, JM Shah, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 21 | 2019 |
| Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling JM Shah, C Bhatt, P Rachamreddy, R Dandamudi, S Saini, D Agonafer International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 20 | 2019 |
| Critical non-thermal consideration for oil cooled data-center J Shah, R Eiland, SHI Rizvi, D Agonafer IMAPS ATW, 2015 | 20 | 2015 |
| Issue on Operational Efficiency for Oil Immersion Cooled Data Centers JM Shah, D Agonafer Session Co-Chair and Presenter for ASME Panel On" Thermal Management …, 2015 | 18 | 2015 |
| Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review S Saini, JM Shah, P Shahi, P Bansode, D Agonafer, P Singh, R Schmidt, ... Journal of Electronic Packaging 144 (3), 030801, 2022 | 15 | 2022 |
| Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling JM Shah, K Padmanaban, H Singh, S Duraisamy Asokan, S Saini, ... Journal of Electronic Packaging 144 (2), 021109, 2022 | 14 | 2022 |
| CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling JM Shah, R Dandamudi, C Bhatt, P Rachamreddy, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 14 | 2019 |
| Characterizing contamination to expand ashrae envelope in airside economization and thermal and reliability in immersion cooling of data centers JM Shah The University of Texas at Arlington, 2018 | 14 | 2018 |
Satyam SainiIntel CorporationVerified email at mavs.uta.edu
