Follow
Andrew Binder
Title
Cited by
Cited by
Year
Demonstration of> 6.0-kV breakdown voltage in large area vertical GaN pn diodes with step-etched junction termination extensions
L Yates, BP Gunning, MH Crawford, J Steinfeldt, ML Smith, VM Abate, ...
IEEE Transactions on Electron Devices 69 (4), 1931-1937, 2022
422022
Analysis of the dependence of critical electric field on semiconductor bandgap
O Slobodyan, J Flicker, J Dickerson, J Shoemaker, A Binder, T Smith, ...
Journal of Materials Research 37 (4), 849-865, 2022
292022
Fabless design approach for lateral optimization of low voltage GaN power HEMTs
A Binder, JS Yuan, B Krishnan, PM Shea
Superlattices and Microstructures 121, 92-106, 2018
152018
Bevel edge termination for vertical GaN power diodes
AT Binder, JR Dickerson, MH Crawford, GW Pickrell, AA Allerman, ...
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2019
132019
Etched and regrown vertical GaN junction barrier Schottky diodes
AT Binder, GW Pickrell, AA Allerman, JR Dickerson, L Yates, J Steinfeldt, ...
2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2021
102021
Development of high-voltage vertical GaN PN diodes
RJ Kaplar, BP Gunning, AA Allerman, MH Crawford, JD Flicker, ...
2020 IEEE International Electron Devices Meeting (IEDM), 5.1. 1-5.1. 4, 2020
102020
Optimization of an enhancement-mode AlGaN/GaN/AlGaN DHFET towards a high breakdown voltage and low figure of merit
A Binder, JS Yuan
2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2017
102017
Overview of wide/ultrawide bandgap power semiconductor devices for distributed energy resources
SK Mazumder, LF Voss, KM Dowling, A Conway, D Hall, RJ Kaplar, ...
IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (4 …, 2023
82023
Study of avalanche behavior in 3 kV GaN vertical PN diode under UIS stress for edge-termination optimization
B Shankar, Z Bian, K Zeng, C Meng, RP Martinez, S Chowdhury, ...
2022 IEEE International Reliability Physics Symposium (IRPS), 2B. 2-1-2B. 2-4, 2022
72022
Simulation and design of step-etched junction termination extensions for GaN power diodes
JR Dickerson, AT Binder, G Pickrell, BP Gunning, RJ Kaplar
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-4, 2020
72020
Effects of heterostructure design on performance for low voltage GaN power HEMTs
A Binder, S Khan, W Yang, JS Yuan, B Krishnan, PM Shea
ECS Journal of Solid State Science and Technology 8 (2), Q15, 2019
72019
A discussion on various experimental methods of impact ionization coefficient measurement in GaN
D Ji, K Zeng, Z Bian, B Shankar, BP Gunning, A Binder, JR Dickerson, ...
AIP Advances 12 (3), 2022
42022
20 kV Gallium Nitride Electromagnetic Pulse Arrestor for Grid Reliability.
R Kaplar, AA Allerman, BP Gunning, G Pickrell, MH Crawford, ...
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2019
42019
Electro-thermal Simulation and Performance Comparison of 1.2 kV 10 A Vertical GaN MOSFETs.
L Yates, A Binder, JR Dickerson, G Pickrell, R Kaplar
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2020
32020
Gate protection for vertical gallium nitride trench MOSFETs: The buried field shield
AT Binder, JA Cooper, J Steinfeldt, AA Allerman, R Floyd, L Yates, ...
e-Prime-Advances in Electrical Engineering, Electronics and Energy 5, 100218, 2023
22023
Identification of the defect dominating high temperature reverse leakage current in vertical GaN power diodes through deep level transient spectroscopy
S DasGupta, O Slobodyan, T Smith, A Binder, J Flicker, R Kaplar, ...
Applied Physics Letters 120 (5), 2022
22022
On-Wafer Investigation of Avalanche Robustness in 1.3 kV GaN-on-GaN PN Diode Under Unclamped Inductive Switching Stress
B Shankar, K Zeng, B Gunning, KJ Lee, RP Martinez, C Meng, XY Zhou, ...
2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2021
22021
Dependence of Critical Electric Field on Semiconductor Bandgap-An Analytical Study.
M Hollis, O Slobodyan, JD Flicker, JR Dickerson, A Binder, T Smith, ...
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2020
22020
Analysis of the dependence of critical electric field on semiconductor bandgap
R Kaplar, O Slobodyan, J Flicker, JR Dickerson, T Smith, A Binder, ...
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2019
22019
TEM Microstructural Analysis of 8” AlxGa1-xN based Enhancement Mode HEMTs and Correlation of Device Reliability Issues with Lattice Defects
B Krishnan, A Kumar, A Velaga, A Binder, JS Yuan, J Su, A Paranjpe
GOMACTech 2018, 2018
22018
The system can't perform the operation now. Try again later.
Articles 1–20