Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing H Ye, C Basaran, D Hopkins Applied Physics Letters 82 (7), 1045-1047, 2003 | 302 | 2003 |

A thermodynamic framework for damage mechanics of solder joints C Basaran, CY Yan | 247 | 1998 |

An irreversible thermodynamics theory for damage mechanics of solids C Basaran, S Nie International Journal of Damage Mechanics 13 (3), 205-223, 2004 | 231 | 2004 |

Failure modes and FEM analysis of power electronic packaging H Ye, M Lin, C Basaran Finite Elements in Analysis and Design 38 (7), 601-612, 2002 | 212 | 2002 |

Moiré interferogram phase extraction: a ridge detection algorithm for continuous wavelet transforms H Liu, AN Cartwright, C Basaran Applied optics 43 (4), 850-857, 2004 | 145 | 2004 |

A thermodynamic model for electrical current induced damage C Basaran, M Lin, H Ye International Journal of Solids and Structures 40 (26), 7315-7327, 2003 | 136 | 2003 |

A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds S Nie, C Basaran International Journal of Solids and Structures 42 (14), 4179-4191, 2005 | 121 | 2005 |

Thermomechanical behavior of micron scale solder joints under dynamic loads Y Zhao, C Basaran, A Cartwright, T Dishongh Mechanics of Materials 32 (3), 161-173, 2000 | 105 | 2000 |

Damage mechanics of electromigration induced failure C Basaran, M Lin Mechanics of Materials 40 (1-2), 66-79, 2008 | 94 | 2008 |

A damage mechanics-based fatigue life prediction model for solder joints H Tang, C Basaran J. Electron. Packag. 125 (1), 120-125, 2003 | 91 | 2003 |

Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations C Basaran, R Chandaroy Applied Mathematical Modelling 22 (8), 601-627, 1998 | 91 | 1998 |

An analytical model for thermal stress analysis of multi-layered microelectronic packaging Y Wen, C Basaran Mechanics of Materials 36 (4), 369-385, 2004 | 90 | 2004 |

Joule heating in single-walled carbon nanotubes T Ragab, C Basaran Journal of Applied Physics 106 (6), 2009 | 89 | 2009 |

Measuring intrinsic elastic modulus of Pb/Sn solder alloys C Basaran, J Jiang Mechanics of Materials 34 (6), 349-362, 2002 | 82 | 2002 |

The size effect in mechanical properties of finite-sized graphene nanoribbon Y Chu, T Ragab, C Basaran Computational Materials Science 81, 269-274, 2014 | 80 | 2014 |

Damage mechanics of microelectronics solder joints under high current densities H Ye, C Basaran, DC Hopkins, D Frear, JK Lin 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 79 | 2004 |

Thermomechanical analysis of solder joints under thermal and vibrational loading C Basaran, R Chandaroy J. Electron. Packag. 124 (1), 60-66, 2002 | 79 | 2002 |

Computational damage mechanics of electromigration and thermomigration W Yao, C Basaran Journal of Applied Physics 114 (10), 2013 | 76 | 2013 |

Mechanical degradation of microelectronics solder joints under current stressing H Ye, C Basaran, DC Hopkins International journal of solids and structures 40 (26), 7269-7284, 2003 | 75 | 2003 |

Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 1—Theory and formulation C Basaran, CS Desai, T Kundu | 74* | 1998 |