Cemal Basaran
Cited by
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Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
H Ye, C Basaran, D Hopkins
Applied Physics Letters 82 (7), 1045-1047, 2003
A thermodynamic framework for damage mechanics of solder joints
C Basaran, CY Yan
An irreversible thermodynamics theory for damage mechanics of solids
C Basaran, S Nie
International Journal of Damage Mechanics 13 (3), 205-223, 2004
Failure modes and FEM analysis of power electronic packaging
H Ye, M Lin, C Basaran
Finite Elements in Analysis and Design 38 (7), 601-612, 2002
Moiré interferogram phase extraction: a ridge detection algorithm for continuous wavelet transforms
H Liu, AN Cartwright, C Basaran
Applied optics 43 (4), 850-857, 2004
A thermodynamic model for electrical current induced damage
C Basaran, M Lin, H Ye
International Journal of Solids and Structures 40 (26), 7315-7327, 2003
A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds
S Nie, C Basaran
International Journal of Solids and Structures 42 (14), 4179-4191, 2005
Thermomechanical behavior of micron scale solder joints under dynamic loads
Y Zhao, C Basaran, A Cartwright, T Dishongh
Mechanics of Materials 32 (3), 161-173, 2000
Damage mechanics of electromigration induced failure
C Basaran, M Lin
Mechanics of Materials 40 (1-2), 66-79, 2008
A damage mechanics-based fatigue life prediction model for solder joints
H Tang, C Basaran
J. Electron. Packag. 125 (1), 120-125, 2003
Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations
C Basaran, R Chandaroy
Applied Mathematical Modelling 22 (8), 601-627, 1998
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
Y Wen, C Basaran
Mechanics of Materials 36 (4), 369-385, 2004
Joule heating in single-walled carbon nanotubes
T Ragab, C Basaran
Journal of Applied Physics 106 (6), 2009
Measuring intrinsic elastic modulus of Pb/Sn solder alloys
C Basaran, J Jiang
Mechanics of Materials 34 (6), 349-362, 2002
The size effect in mechanical properties of finite-sized graphene nanoribbon
Y Chu, T Ragab, C Basaran
Computational Materials Science 81, 269-274, 2014
Damage mechanics of microelectronics solder joints under high current densities
H Ye, C Basaran, DC Hopkins, D Frear, JK Lin
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
Thermomechanical analysis of solder joints under thermal and vibrational loading
C Basaran, R Chandaroy
J. Electron. Packag. 124 (1), 60-66, 2002
Computational damage mechanics of electromigration and thermomigration
W Yao, C Basaran
Journal of Applied Physics 114 (10), 2013
Mechanical degradation of microelectronics solder joints under current stressing
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 40 (26), 7269-7284, 2003
Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 1—Theory and formulation
C Basaran, CS Desai, T Kundu
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