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Co-authors
- Max Q.-H. MengSouthern University of Science and TechnologyVerified email at ieee.org
- Zhe MinShandong University/University College LondonVerified email at ucl.ac.uk
- Shuang SONGHarbin Institutes of Technology, ShenzhenVerified email at hit.edu.cn
- Jiaole WangHITSZVerified email at hit.edu.cn
- Ang ZhangPh.D of Electronic Engineering, The Chinese Uniersity of Hong KongVerified email at link.cuhk.edu.hk
- Yue Yu (余 跃)Research Assistant Professor, The Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Erli LyuMacao Polytechnic UniversityVerified email at mpu.edu.mo
- Hongliang RenChinese University of Hong Kong | National University of Singapore | JHU/Harvard(RF) | CUHK(PhD)Verified email at jhu.edu
- Junnan XueCUHKVerified email at stu.hit.edu.cn
- Botao Lin (林铂涛)Student,Harbin Institute of Technology (Shenzhen)Verified email at stu.hit.edu.cn
- Zhu DelongThe Chinese University of Hong KongVerified email at link.cuhk.edu.hk
- Tinghua ZhangPhD student in Chinese University of Hong KongVerified email at link.cuhk.edu.hk
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Zhengyan Zhang (张峥岩)
PhD student, The Hong Kong Polytechnic University
Verified email at connect.polyu.hk - Homepage