| Characterization of contact resistance stability in MEM relays with tungsten electrodes Y Chen, R Nathanael, J Jeon, J Yaung, L Hutin, TJK Liu Journal of Microelectromechanical Systems 21 (3), 511-513, 2012 | 73 | 2012 |
| A new switching device for printed electronics: inkjet-printed microelectromechanical relay ES Park, Y Chen, TJK Liu, V Subramanian Nano letters 13 (11), 5355-5360, 2013 | 54 | 2013 |
| Stable ruthenium-contact relay technology for low-power logic IR Chen, Y Chen, L Hutin, V Pott, R Nathanael, TJK Liu 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 28 | 2013 |
| Reliability of MEM relays for zero leakage logic Y Chen, R Nathanael, J Yaung, L Hutin, TJK Liu Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and …, 2013 | 21 | 2013 |
| Inkjet-Printed Micro-Electro-Mechanical Switches ES Park, Y Chen, TJK Liu, V Subramanian Electron Devices Meeting (IEDM), 2011 IEEE International, 29.2.1 - 29.2.4, 2011 | 12 | 2011 |
| Acoustic relief in MEMS A Kueffner, SB Lee, Y Chen, Y Guo, HUI Jeremy, JJ Albers, R Jonathan US Patent 11,274,034, 2022 | 9 | 2022 |
| Micro-relay reliability improvement by inkjet-printed microshell encapsulation Y Chen, ES Park, IR Chen, L Hutin, V Subramanian, TJK Liu Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS …, 2013 | 7 | 2013 |
| A revisit to the lumped element model of capacitive MEMS microphones Y Du, M Kuntzman, Y Chen The Journal of the Acoustical Society of America 143 (3_Supplement), 1776-1776, 2018 | 3 | 2018 |
| Experimental Studies of Contact Detachment Delay in Microrelays for Logic Applications Y Chen, I Chen, C Qian, A Peschot, TK Liu Electron Devices, IEEE Transactions on 62 (8), 2695 - 2699, 2015 | 3 | 2015 |
| Acoustic transducers for microphone assemblies having non-circular apertures J Johnson, Y Chen US Patent 11,483,645, 2022 | | 2022 |
