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Gianluca Rengo
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Epitaxial growth of Ga-doped SiGe for reduction of contact resistance in finFET source/drain materials
J Margetis, D Kohen, C Porret, L Lima, R Khazaka, G Rengo, R Loo, ...
ECS Transactions 93 (1), 7, 2019
122019
Highly Doped Si1-XGex Epitaxy in View of S/D Applications
G Rengo, C Porret, AY Hikavyy, E Rosseel, N Nakazaki, G Pourtois, ...
ECS Transactions 98 (5), 27, 2020
92020
Epitaxial growth of active Si on top of SiGe etch stop layer in view of 3D device integration
R Loo, A Jourdain, G Rengo, C Porret, A Hikavyy, M Liebens, L Becker, ...
ECS Journal of Solid State Science and Technology 10 (1), 014001, 2021
42021
B and Ga Co-Doped Si1− xGex for p-Type Source/Drain Contacts
G Rengo, C Porret, A Hikavyy, E Rosseel, M Ayyad, RJH Morris, ...
ECS Journal of Solid State Science and Technology 11 (2), 024008, 2022
22022
Low temperature source/drain epitaxy and functional silicides: essentials for ultimate contact scaling
C Porret, JL Everaert, M Schaekers, LA Ragnarsson, A Hikavyy, ...
2022 International Electron Devices Meeting (IEDM), 34.1. 1-34.1. 4, 2022
12022
Low Temperature Epitaxy of In Situ GaDoped Si1-XGex: Dopant Incorporation, Structural and Electrical Properties
G Rengo, C Porret, AY Hikavyy, G Coenen, M Ayyad, RJH Morris, ...
ECS Transactions 109 (4), 249, 2022
12022
Effect of Strain on the Epitaxy of B-Doped Si0. 5Ge0. 5 Source/Drain Layers
G Rengo, C Porret, AY Hikavyy, E Rosseel, M Ayyad, RJH Morris, ...
ECS Transactions 104 (4), 167, 2021
12021
(Invited) Characterization of Doping and Activation Processes Using Differential Hall Effect Metrology (DHEM)
A Joshi, G Rengo, C Porret, KL Lin, CH Chang, BM Basol
Electrochemical Society Meeting Abstracts 239, 1009-1009, 2021
12021
Characterization of Annealing and Dopant Activation Processes Using Differential Hall Effect Metrology (DHEM)
A Joshi, G Rengo, C Porret, KL Lin, CH Chang, BM Basol
ECS Transactions 102 (2), 113, 2021
12021
Low temperature selective growth of Ga-doped and Ga–B co-doped germanium source/drain for PMOS devices
C Porret, G Rengo, M Ayyad, A Hikavyy, E Rosseel, R Langer, R Loo
Japanese Journal of Applied Physics 62 (SC), SC1043, 2023
2023
Ab initio investigation of Ga doping in Si1-xGex: effect of biaxial strain and interaction of dopants with point-defects
G Rengo, G Pourtois, C Porret, R Loo, A Vantomme
Extended Abstracts of the 2022 International Conference on Solid State …, 2022
2022
(Invited) Strain-Related Peculiarities of B Incorporation in Epitaxial Si1-XGex Source/Drain Materials and Their Impact on Electrical Properties
C Porret, G Rengo, AY Hikavyy, E Rosseel, M Ayyad, RJH Morris, ...
Electrochemical Society Meeting Abstracts 239, 1096-1096, 2021
2021
Effect of Strain on the Epitaxy of B-Doped Si0. 5Ge0. 5 Source/Drain Layers
A Vantomme, G Rengo, C Porret, A Hikavyy, E Rosseel, M Ayyad, ...
2021
Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration
L Becker, P Storck, R Loo, A Jourdain, G Rengo, C Porret, A Hikavyy, ...
ELECTROCHEMICAL SOC INC, 2021
2021
B and Ga Co-Doping in Epitaxial SiGe: Challenges and Opportunities
C Porret, G Rengo, AY Hikavyy, L Lima, Q Xie, B Douhard, M Ayyad, ...
Electrochemical Society Meeting Abstracts prime2020, 1732-1732, 2020
2020
Epitaxial growth of active Si on top of SiGe etch stop layer in view of 3D device integration
R Loo, A Jourdain, G Rengo, C Porret, AY Hikavyy, M Liebens, L Becker, ...
ECS Transactions 98 (4), 157, 2020
2020
Highly doped SiGe epitaxy in view of S/D applications
G Rengo, C Porret, A Hikavyy, E Rosseel, N Nakazaki, G Pourtois, ...
2020
Low Ti/SiGe: B contact resistivities by optimizing strain in epitaxial SiGe: B/Si and thermal treatments applied to contacts
YH Huang, C Porret, A Hikavyy, G Rengo, H Yu, M Schaekers, ...
EMRS Fall Meeting 2019, Location: Warsaw, Poland, 2019
2019
Improving the electrical properties of epitaxial SiGe: B with excimer laser annealing treatments
YH Huang, G Rengo, C Porret, A Hikavyy, L Lima, R Khazaka, D Kohen, ...
EMRS Fall Meeting 2019, Location: Warsaw, Poland, 2019
2019
Epitaxial SiGe: B for advanced p-MOS contacts: low contact resistivities achieved by optimizing strain in SiGe and thermal treatments applied to contacts
YH Huang, C Porret, A Hikavyy, G Rengo, H Yu, M Schaekers, ...
2019
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