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Co-authors
Dacheng TaoThe University of SydneyVerified email at sydney.edu.au- Xuelong LiProfessor, Northwestern Polytechnical University, ChinaVerified email at ieee.org
- Nannan WangProfessor, Xidian UniversityVerified email at xidian.edu.cn
- Cheng Deng （邓成）School of Electronic Engineering, Xi'an 710071, Xidian UniversityVerified email at mail.xidian.edu.cn
- Hongbing Ji（姬红兵）Xidian UniversityVerified email at xidian.edu.cn
- Lihuo HeSchool of Electronic Engineering, Xidian UniversityVerified email at mail.xidian.edu.cn
- Bin WangAssociate Prof. in Xidian UniversityVerified email at xidian.edu.cn
- Licheng JiaoProfessor of Xidian University, IEEE FellowVerified email at mail.xidian.edu.cn
- Zhenxing NiuAlibaba GroupVerified email at alibaba-inc.com
- Lingling AnSchool of Computer Science and Technology, Xidian UniversityVerified email at mail.xidian.edu.cn
- Qi TianProfessor, IEEE Fellow, Department of Computer Science, University of Texas at San AntonioVerified email at cs.utsa.edu
- Xi YangXidian UniversityVerified email at xidian.edu.cn
- Souleymane Balla-ArabéPh. D., Information and Communication Engineering, Xidian UniversityVerified email at ieee.org
- Chunlei PengXidian UniversityVerified email at xidian.edu.cn
- Gang HuaVice President and Chief Scientist, Wormpex AI Research, IEEE & IAPR FellowVerified email at bianlifeng.com
- Xiaoou TangThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
- Wei LiuTencentVerified email at ee.columbia.edu
- Feiping NieOPTIMALVerified email at mails.tsinghua.edu.cn
- Juanying XieShaanxi Normal UniversityVerified email at snnu.edu.cn
- Mingjin ZhangXidian UniversityVerified email at xidian.edu.cn
Xinbo Gao（高新波）
School of Electronic Engineering, Xidian University
Verified email at mail.xidian.edu.cn - Homepage