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Yang Hu
Yang Hu
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Year
Electrodeposition of superconducting rhenium with water-in-salt electrolyte
Q Huang, Y Hu
Journal of The Electrochemical Society 165 (16), D796, 2018
212018
Effects of dimethylglyoxime and cyclohexane dioxime on the electrochemical nucleation and growth of cobalt
Y Hu, Q Huang
Journal of The Electrochemical Society 166 (1), D3175, 2018
132018
Effects of organic additives on the impurity and grain structure of electrodeposited cobalt
Y Hu, S Deb, D Li, Q Huang
Electrochimica Acta 368, 137594, 2021
112021
Grain growth and superconductivity of rhenium electrodeposited from water-in-salt electrolytes
WD Sides, E Hassani, DP Pappas, Y Hu, TS Oh, Q Huang
Journal of Applied Physics 127 (8), 2020
102020
Influence of furil dioxime on cobalt electrochemical nucleation and growth
Y Hu, T Lyons, Q Huang
Journal of The Electrochemical Society 167 (2), 022509, 2020
82020
Oscillatory behavior in cobalt electrodeposition with 3-mercapto-1-propanesulfonate
Y Hu, Q Huang
The Journal of Physical Chemistry C 124 (39), 21608-21616, 2020
72020
Electrochemical deposition and anodic stripping of PdZn bimetallic compound
RJ Morelock, WD Sides, Y Hu, Q Huang
Journal of Electroanalytical Chemistry 815, 8-15, 2018
52018
Electrodeposition of Cu, Co and Re from Water in Salt Electrolytes
Q Huang, WD Sides, S De, Y Hu
Electrochemical Society Meeting Abstracts 236, 2116-2116, 2019
42019
Effects of ethylenediamine tetrakis (ethoxylate-block-propoxylate) tetrol on tin electrodeposition
Y Hu, K Ahammed, Q Liu, R Williams, Q Huang
Electrochimica Acta 421, 140476, 2022
22022
Thermal Annealing and Impurities Incorporation of Electrodeposited Cobalt Thin Film
Y Hu, Q Huang
Electrochemical Society Meeting Abstracts 236, 1256-1256, 2019
12019
(Invited) Cobalt Electrodeposition for Advanced Interconnect Applications
Q Huang, Y Hu, N Scudder
Electrochemical Society Meeting Abstracts 240, 651-651, 2021
2021
Electrodeposition of Cobalt for Advanced Interconnect Applications
Y Hu
The University of Alabama, 2021
2021
Effect of Dimethylglyoxime on Cobalt Bottom-up Filling
Y Hu, Q Huang
Electrochemical Society Meeting Abstracts prime2020, 1776-1776, 2020
2020
Electrochemical Nucleation and Growth of Cobalt in Presence of Dioxime Additives
Y Hu, Q Huang
Electrochemical Society Meeting Abstracts 235, 1053-1053, 2019
2019
(Invited) Electrodeposition of Copper and Cobalt in Presence of Some Organic Additives
Q Huang, TW Lyons, Y Hu, WD Sides
Electrochemical Society Meeting Abstracts aimes2018, 1111-1111, 2018
2018
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