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Wallace C.H. ChoyDepartment of Electrical and Electronic Engineering, the University of Hong KongVerified email at eee.hku.hk
Li Jun JiangDept. of ECE, Missouri University of Science and TechnologyVerified email at umsystem.edu
Weng Cho ChewDistinguished Professor, Purdue UniversityVerified email at purdue.edu
Menglin L.N. CHENThe Hong Kong Polytechnic UniversityVerified email at connect.hku.hk
Fengxian XIEFudan UniversityVerified email at fudan.edu.cn
Xingang Ren(任信钢)Anhui UniversityVerified email at ahu.edu.cn
Xuanhua LiWuhan University of Techonology, USTC, the University of Hong KongVerified email at eee.hku.hk
Xiaoyan Y. Z. XiongThe University of Hong KongVerified email at eee.hku.hk
Chongwen Huang (黄崇文)Professor, Zhejiang UniversityVerified email at zju.edu.cn
Zishuai Wang (王子帅)Department of Electrical and Electronic Engineering, University of Hong KongVerified email at eee.hku.hk
Xiaoming ChenXi'an Jiaotong UniversityVerified email at mail.xjtu.edu.cn
Jian Wei YouSoutheast UniversityVerified email at seu.edu.cn
Merouane DebbahKU 6G Center, Khalifa University, CentralesupelecVerified email at centralesupelec.fr
Shuai S. A. YuanPhD candidate in Electrical Engineering, Zhejiang UniversityVerified email at zju.edu.cn
Huan Huan ZhangXidian UniversityVerified email at xidian.edu.cn
Chau YuenIEEE Fellow, Highly Cited Researcher, Nanyang Technological UniversityVerified email at ntu.edu.sg
Zhaoyang ZhangZhejiang UniversityVerified email at zju.edu.cn
Qi DaiUniversity of IllinoisVerified email at illinois.edu
Ling-Jun YangUniversity of Electronic Science and Technology of China;national university of sigaporeVerified email at u.nus.edu
Xiaofeng ChangNational Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences andVerified email at smail.nju.edu.cn