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Wallace C.H. ChoyDepartment of Electrical and Electronic Engineering, the University of Hong KongVerified email at eee.hku.hk
Weng Cho ChewDistinguished Professor, Purdue UniversityVerified email at purdue.edu
Menglin L.N. CHENThe Hong Kong Polytechnic UniversityVerified email at connect.hku.hk
Fengxian XIEFudan UniversityVerified email at fudan.edu.cn
Xingang Ren(任信钢)Anhui University/The University of Hong KongVerified email at eee.hku.hk
Xuanhua LiWuhan University of Techonology, USTC, the University of Hong KongVerified email at eee.hku.hk
Xiaoyan Y. Z. XiongThe University of Hong KongVerified email at eee.hku.hk
Zishuai Wang (王子帅)Department of Electrical and Electronic Engineering, University of Hong KongVerified email at eee.hku.hk
Qi DaiUniversity of IllinoisVerified email at illinois.edu
Xiaofeng ChangNational Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences andVerified email at smail.nju.edu.cn
Yang Yang (楊陽)The Tannas Jr. Chair Professor, UCLAVerified email at ucla.edu
Yongpin ChenProfessor of Electronic Engineering, University of Electronic Science and Technology ofVerified email at uestc.edu.cn
Huan Huan ZhangXidian UniversityVerified email at xidian.edu.cn
Yu Mao WuFudan University, ChinaVerified email at fudan.edu.cn
Jingbi You (游经碧)Professor, Institute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Yang Yang(杨旸)Professor, Department of Optical engineering@Zhejiang UniversityVerified email at zju.edu.cn
Jian Wei YouSoutheast UniversityVerified email at seu.edu.cn
Xiaoming ChenXi'an Jiaotong UniversityVerified email at mail.xjtu.edu.cn
Nicolae C PanoiuUCLVerified email at ucl.ac.uk
Lu Zhu (朱璐)Sun Yat-sen UniversityVerified email at mail.sysu.edu.cn
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