Get my own profile
Co-authors
Yu HuaProfessor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Min FuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Hong JiangUniversity of Texas at ArlingtonVerified email at uta.edu
Yukun ZhouPhD student, Huazhong University of Science & Technology, Wuhan, ChinaVerified email at hust.edu.cn
Lei TianStaff Engineer in TintriVerified email at tintri.com
Xubin HeTemple UniversityVerified email at temple.edu
Xiangyu ZouHarbin Institute of TechnologyVerified email at mail.ustc.edu.cn
Yuchong HuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Qing LiuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Fred DouglisPerspecta LabsVerified email at Perspectalabs.com
Philip ShilaneDell TechnologiesVerified email at dell.com
Yujuan TanChongqing University Verified email at cqu.edu.cn
Pengfei ZuoHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Erik KruusNEC Labs AmericaVerified email at nec-labs.com
Weizhe ZhangProfessor of Computer Science, Harbin Institute of TechnologyVerified email at hit.edu.cn
Tao LuVirginia Commonwealth UniversityVerified email at vcu.edu
Dingwen TaoSchool of EECS, Washington State UniversityVerified email at wsu.edu
Cristian UngureanuGoogleVerified email at acm.org
Yuncheng Guo腾讯(Tencent)Verified email at hust.edu.cn
Xue (Steve) LiuFIEEE; ACM DM; Professor & William Dawson Scholar, McGill Univ.; VP R&D, Chief Scientist Samsung AIVerified email at cs.mcgill.ca
Wen Xia
Verified email at hit.edu.cn - Homepage