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- Dan FengHuazhong University of Sci. and Tech.Verified email at hust.edu.cn
- Yu HuaProfessor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn
- Xiangyu ZouHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn
- Hong JiangUniversity of Texas at ArlingtonVerified email at uta.edu
- Min FuTencentVerified email at tencent.com
- Yukun ZhouPhD student, Huazhong University of Science & Technology, Wuhan, ChinaVerified email at hust.edu.cn
- Philip ShilaneDell TechnologiesVerified email at dell.com
- Lei TianStaff Engineer in TintriVerified email at tintri.com
- Yuchong HuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
- Qing LIAOHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn
- Xubin HeTemple UniversityVerified email at temple.edu
- Dingwen TaoChinese Academy of Sciences, IEEE/ACM Senior MemberVerified email at ict.ac.cn
- Weizhe ZhangProfessor of Peng Cheng Laboratory & Harbin Institute of TechnologyVerified email at hit.edu.cn
- Fred DouglisPeraton LabsVerified email at Peratonlabs.com
- Qing LiuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
- Yujuan TanChongqing University Verified email at cqu.edu.cn
- Pengfei ZuoHuawei CloudVerified email at huawei.com
- Yuanyuan SunAlibaba GroupVerified email at alibaba-inc.com
- Tao LuDapuStorVerified email at dapustor.com
- Erik KruusNEC Labs AmericaVerified email at nec-labs.com