| Evaluation of corrosion resistance of Ag-alloy bonding wires for electronic packaging CH Chen, YC Lin, YT Shih, SC Chen, CH Tsai, SC Wang, TH Chuang IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (1 …, 2017 | 17 | 2017 |
| Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire CH Chen, PI Lee, TH Chuang Journal of Alloys and Compounds 913, 165266, 2022 | 10 | 2022 |
| Mechanism of the electromigration in ag-pd alloy bonding wires TH Chuang, CH Chen Metallurgical and Materials Transactions A 49, 5904-5910, 2018 | 10 | 2018 |
| Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments CH Chen, YC Lai, TH Chuang Journal of Alloys and Compounds 863, 158619, 2021 | 9 | 2021 |
| Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy CH Chen, YK Sun, YC Lai, SY Chang, TH Chuang Applied Sciences 11 (20), 9660, 2021 | 8 | 2021 |
| Intermetallic compounds at the interfaces of Ag–Pd alloy stud bumps with Al pads TH Chuang, SW Hsu, CH Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| Ultrasonic bonding of Ag and ag-alloy Ribbon—An innovative alternative for high power IC packages CH Chen, YC Lin, A Groth, YC Lai, CY Lin, HM Chang, TH Chuang IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi0.5Sb1.5Te3 Thermoelectric Material and a Cu Electrode TH Chuang, SW Hsu, YC Lin, WT Yeh, CH Chen, PI Lee, PC Wu, ... Journal of Electronic Materials 49, 3391-3399, 2020 | 7 | 2020 |
| Electrolytic migration of Ag-Pd alloy wires with various Pd contents YC Lin, CH Chen, YZ He, SC Chen, TH Chuang Journal of Electronic Materials 47, 3634-3638, 2018 | 7 | 2018 |
| Optimization of Ag-alloy ribbon bonding—An approach to reliable interconnection for high power IC packaging CH Chen, TH Chuang Microelectronics Reliability 137, 114786, 2022 | 4 | 2022 |
| Effects of grain size on the Ag dissolution and ion migration of Ag-4Pd alloy wires YC Lin, PI Lee, PC Wu, CH Chen, TH Chuang Journal of Electronic Materials 50, 5955-5964, 2021 | 3 | 2021 |
| Interfacial reactions of Ag and Ag-4Pd stud bumps with Sn-3Ag-0.5 Cu solder for flip chip packaging CH Chen, SW Hsu, TH Chuang Journal of Electronic Materials 50, 249-257, 2021 | 3 | 2021 |
| Intermetallic growth and thermal impedance at the In32. 5Bi16. 5Sn/Cu interface CH Chen, CL Yang, TH Chuang Journal of Alloys and Compounds 936, 168309, 2023 | 2 | 2023 |
| The effect of oxalic acid as the pre-activator for the electropolishing of additive manufactured titanium-based materials and its characterization CH Chen, CY Lee, MD Ger, SY Jian, JC Hung, PJ Yang, CH Kao, ... Polymers 14 (19), 4198, 2022 | 2 | 2022 |
| Cu/Al Clad and Ag-4Pd ribbon bonding for high power IC packages CH Chen, J Hoefer, YC Lin, CY Lin, TH Chuang Sensors & Transducers 235 (7), 37-42, 2019 | 2 | 2019 |
| Interfacial reactions in Zn4Sb3/titanium diffusion couples CH Chen, WT Yeh, TH Chuang Journal of Alloys and Compounds 881, 160630, 2021 | 1 | 2021 |
| Formation of Ag Dendrites During the Electrolytic Migration Between Ag-4Pd Wire Couple in Water Under Bias CH Chen, YC Lin, PC Wu, TH Chuang JOM 75 (6), 1880-1888, 2023 | | 2023 |
| Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes CH Chen, PI Lee, WT Yeh, TH Chuang Metallurgical and Materials Transactions A 53, 136-146, 2022 | | 2022 |
| Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires C Tung-Han, C Chun-Hao Metallurgical and Materials Transactions 49 (11), 5904-5910, 2018 | | 2018 |
| Applications of Ag-alloy stud bump for IC and LED packages HH Tsai, CH Tsai, JD Lee, D Chang, YT Shih, CH Chen, TH Chuang 2014 9th International Microsystems, Packaging, Assembly and Circuits …, 2014 | | 2014 |
