| A comparative study of energy savings in a liquid-cooled server by dynamic control of coolant flow rate at server level P Shahi, S Saini, P Bansode, D Agonafer IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 32 | 2021 |
| Design, development, and characterization of a flow control device for dynamic cooling of liquid-cooled servers P Shahi, AP Deshmukh, HY Hurnekar, S Saini, P Bansode, R Kasukurthy, ... Journal of Electronic Packaging 144 (4), 041008, 2022 | 30 | 2022 |
| Numerical analysis of oil immersion cooling of a server using mineral oil and Al2O3 nanofluid A Niazmand, P Murthy, S Saini, P Shahi, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 29 | 2020 |
| CFD analysis on liquid cooled cold plate using copper nanoparticles P Shahi, S Agarwal, S Saini, A Niazmand, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 26 | 2020 |
| CFD investigation of dispersion of airborne particulate contaminants in a raised floor data center S Saini, P Shahi, P Bansode, A Siddarth, D Agonafer 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 26 | 2020 |
| CFD simulation of two-phase immersion cooling using FC-72 dielectric fluid A Niazmand, T Chauhan, S Saini, P Shahi, PV Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 24 | 2020 |
| Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center V Shalom Simon, H Modi, KB Sivaraju, P Bansode, S Saini, P Shahi, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 16 | 2022 |
| CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware S Saini, KK Adsul, P Shahi, A Niazmand, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 16 | 2020 |
| Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review S Saini, JM Shah, P Shahi, P Bansode, D Agonafer, P Singh, R Schmidt, ... Journal of Electronic Packaging 144 (3), 030801, 2022 | 15 | 2022 |
| Assessment of Reliability Enhancement in High-Power CPUs and GPUs Using Dynamic Direct-to-Chip Liquid Cooling P Shahi, A Mathew, S Saini, P Bansode, R Kasukurthy, D Agonafer Journal of Enhanced Heat Transfer 29 (8), 2022 | 14 | 2022 |
| Numerical investigation on effect of target coolant delivery in liquid-cooled microchannel heat SINKS P Shahi, A Deshmukh, HY Hurnekar, S Saini, P Bansode, D Agonafer Journal of Enhanced Heat Transfer 30 (1), 2023 | 13 | 2023 |
| Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level H Modi, P Shahi, A Sivakumar, S Saini, P Bansode, V Shalom, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 13 | 2022 |
| A Numerical Study on Multi-Objective Design Optimization of Heat Sinks for Forced and Natural Convection Cooling of Immersion-Cooled Servers S Saini, T Wagh, P Bansode, P Shahi, J Herring, J Lamotte-Dawaghreh, ... Journal of Enhanced Heat Transfer 29 (8), 2022 | 12 | 2022 |
| Experimental study of latent heat thermal energy storage system for medium temperature solar applications A Kumar, P Shahi, SK Saha Proceedings of the 4th World Congress on Mechanical, Chemical, and Material …, 2018 | 12 | 2018 |
| CFD analysis of Heat capture ratio in a hybrid cooled server V Shalom Simon, LS Reddy, P Shahi, A Valli, S Saini, H Modi, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 10 | 2022 |
| Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server H Modi, P Shahi, LSR Chinthaparthy, G Gupta, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 9 | 2022 |
| Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, S Saini, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 8 | 2022 |
| Experimental Study Demonstrating Pumping Power Savings at Rack Level Using Dynamic Cooling P Shahi, S Saini, P Bansode, R Kasukurthy, D Agonafer Journal of Enhanced Heat Transfer 29 (6), 2022 | 8 | 2022 |
| Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy et al." A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low … A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury International Electronic Packaging Technical Conference and Exhibition 86557 …, 0 | 8 | |
| Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics S Saini, P Shahi, P Bansode, JM Shah, D Agonafer Journal of Electronic Packaging 144 (2), 024501, 2022 | 7 | 2022 |
Pratik BansodeUniversity of University at ArlingtonVerified email at mavs.uta.edu
