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Ronit Das
Ronit Das
Other namesRonit Subrata Das
Apple Inc., Binghamton University (SUNY)
Verified email at binghamton.edu - Homepage
Title
Cited by
Cited by
Year
Understanding and preventing Cu–Sn micro joint defects through design and process control
M Njuki, S Thekkut, R Das, N Shahane, P Thompson, K Mirpuri, ...
Journal of Applied Electrochemistry, 1-13, 2022
142022
Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures
M Yadav, T Alghoul, S Thekkut, R Das, C Greene, P Borgesen, ...
Journal of Electronic Packaging 144 (3), 031001, 2022
102022
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020
72020
Preventing Void Growth Between Ni3Sn4 and Solder
M Njuki, S Thekkut, R Das, P Borgesen, N Dimitrov
Journal of Electronic Materials 51 (11), 6333-6346, 2022
62022
Early transient creep of single crystal SnAgCu solder joints
R Das, S Thekkut, RS Sivasubramony, T Alghoul, A Mahmood, S Joshi, ...
Journal of Materials Science: Materials in Electronics 33 (17), 13657-13667, 2022
22022
Evolution of Intermetallic Morphology and Void Formation in Microjoints of Nickel/Tin/Nickel
R Das
State University of New York at Binghamton, 2019
12019
All-Electrochemical Synthesis of SnBi/SnAgCu Structures for Low-Temperature Formation of High-Reliability Solder Microjoints
M Njuki, A Pasha, R Das, P Borgesen, N Dimitrov
Journal of Alloys and Compounds, 174699, 2024
2024
Constitutive Relations and Damage Properties of Pb-Free Low Temperature SnAgCu-Bi Solder Joints in Fatigue
RS Das
State University of New York at Binghamton, 2023
2023
Chapter Thirteen Fatigue Damage In Microelectronic Packages
H Lu, R Das
WIT Transactions on State-of-the-art in Science and Engineering 1, 2005
2005
Chapter Thirteen
H Lu, R Das
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Articles 1–10