| Buckling initiation and displacement dependence in compression of vertically aligned carbon nanotube arrays C Cao, A Reiner, C Chung, SH Chang, I Kao, RV Kukta, CS Korach Carbon 49 (10), 3190-3199, 2011 | 74 | 2011 |
| Distribution of diamond grains in fixed abrasive wire sawing process C Chung, GD Tsay, MH Tsai The International journal of advanced manufacturing technology 73, 1485-1494, 2014 | 65 | 2014 |
| Long short-term memory approach to estimate battery remaining useful life using partial data B Chinomona, C Chung, LK Chang, WC Su, MC Tsai Ieee Access 8, 165419-165431, 2020 | 64 | 2020 |
| Depth of cut per abrasive in fixed diamond wire sawing C Chung, L Nhat The International Journal of Advanced Manufacturing Technology, 1-10, 2015 | 53 | 2015 |
| Generation of diamond wire sliced wafer surface based on the distribution of diamond grits C Chung, L Nhat International journal of precision engineering and manufacturing 15 (5), 789-796, 2014 | 50 | 2014 |
| Fabrication of PDMS passive micromixer by lost-wax casting C Chung, YJ Chen, PC Chen, CY Chen International journal of precision engineering and manufacturing 16, 2033-2039, 2015 | 37 | 2015 |
| Effects of mixed abrasive grits in slurries on free abrasive machining (FAM) processes S Bhagavat, JC Liberato, C Chung, I Kao International Journal of Machine Tools and Manufacture 50 (9), 843-847, 2010 | 34 | 2010 |
| Hybrid model-and signal-based chatter detection in the milling process MK Liu, MQ Tran, C Chung, YW Qui Journal of Mechanical Science and Technology 34, 1-10, 2020 | 24 | 2020 |
| Multiple criteria optimisation in coated abrasive grinding of titanium alloy using minimum quantity lubrication C Kuo, Y Hsu, C Chung, CCA Chen International Journal of Machine Tools and Manufacture 115, 47-59, 2017 | 21 | 2017 |
| Green's function and forced vibration response of damped axially moving wire C Chung, I Kao Journal of Vibration and Control 18 (12), 1798-1808, 2012 | 19 | 2012 |
| Modeling of axially moving wire with damping: Eigenfunctions, orthogonality and applications in slurry wiresaws C Chung, I Kao Journal of Sound and Vibration 330 (12), 2947-2963, 2011 | 19 | 2011 |
| Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping X Zhu, C Chung, CS Korach, I Kao Wear 305 (1-2), 14-22, 2013 | 16 | 2013 |
| Experimental study and modeling of lapping using abrasive grits with mixed sizes C Chung, CS Korach, I Kao | 16 | 2011 |
| Wafer manufacturing: shaping of single crystal silicon wafers I Kao, C Chung John Wiley & Sons, 2021 | 15 | 2021 |
| Optimization of turning parameters based on tool wear and machining cost for various parts C Chung, PC Wang, B Chinomona The International Journal of Advanced Manufacturing Technology 120 (7), 5163 …, 2022 | 14 | 2022 |
| Estimation of process damping coefficient using dynamic cutting force model C Chung, MQ Tran, MK Liu International Journal of Precision Engineering and Manufacturing 21, 623-632, 2020 | 13 | 2020 |
| Mechanical properties and thermal characteristics of poly (lactic acid) and paraffin wax blends prepared by conventional melt compounding and sub-critical gas-assisted … YJ Chen, A Huang, T Ellingham, C Chung, LS Turng European Polymer Journal 98, 262-272, 2018 | 13 | 2018 |
| Chatter detection in milling process based on time-frequency analysis MK Liu, QM Tran, YW Qui, CH Chung International manufacturing science and engineering conference 50725 …, 2017 | 13 | 2017 |
| Damped vibration response at different speeds of wire in slurry wiresaw manufacturing operations C Chung, I Kao International Manufacturing Science and Engineering Conference 48524, 129-138, 2008 | 8 | 2008 |
| Abrasive distribution of the fixed diamond wire in wire sawing process C Chung Advanced Materials Research 579, 145-152, 2012 | 7 | 2012 |
