| MXene–graphene field-effect transistor sensing of influenza virus and SARS-CoV-2 Y Li, Z Peng, NJ Holl, MR Hassan, JM Pappas, C Wei, OH Izadi, Y Wang, ... ACS omega 6 (10), 6643-6653, 2021 | 114 | 2021 |
| Trend Analysis of Dissipated Electrostatic Discharge Energy in Touchscreen Displays Z Peng, S Marathe, H Rezaei, G Maghlakelidze, D Pommerenke, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 3 | 2020 |
| Characterization and modeling of commercial ICs for system-efficient ESD design Z Peng, Y Xu, M Yea, S Bub, S Holland, DH Kim, D Pommerenke, ... IEEE Transactions on Electromagnetic Compatibility 64 (6), 1802-1811, 2022 | 2 | 2022 |
| Radiated Emission Tests for High-frequency Router Systems in Class A: Discussion and Improvement W Zhang, Z Peng, X Wang, DH Kim, J Drewniak 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 119-124, 2021 | 2 | 2021 |
| Experimental characterization and methodology for full-wave modeling of ESD to displays H Rezaei, Z Peng, S Marathe, D Pommerenke, CW Lam, A Foudazi, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 2 | 2020 |
| On-chip ESD protection structure modeling methodology Z Peng, OH Izadi, L Shen, M Yea, P Wei, J Meiguni, A Foudazi, S Marathe, ... | 1 | 2022 |
| Wearable MXene‐Graphene Sensing of Influenza and SARS‐CoV‐2 Virus in Air and Breath: From Lab to Clinic Y Li, Z Peng, J Li, C Wei, S Liu, W Hao, H Cheng, C Burton, Y Wang, ... Advanced Materials Technologies 9 (3), 2201787, 2024 | | 2024 |
| Characterization and Modeling of Sparkless Discharge to a Touch Screen Display J Zhou, CW Lam, Z Peng, D Beetner, D Pommerenke 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | | 2023 |
| Reconfigurable Intelligent Surface (RIS) Design for 5G n260 Frequency Band R Yazdani, MK Mathew, Z Peng, DH Kim 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | | 2023 |
| Analysis on Extraction of Potential Radiated Emission Limit line for Data Center Equipment from 10 GHz to 40 GHz Z Peng, W Zhang, JH Kwon, DH Kim 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | | 2023 |
| Analysis of Electro-static Discharge to Through-silicon Via Z Peng, W Zhang, DH Kim DesignCon, 2021 | | 2021 |
| Voltage-dependency Effect of Through-silicon Vias on the Power Distribution Network Z Wei, W Xu, P Zhekun, P Bo, K DongHyun DesignCon, 2021 | | 2021 |
| Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis R Hua, O Hoseini, Z Peng, H Shumiya, S Konno, K Araki, D Pommerenke, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | | 2020 |
| Editorial Introduction to the Special Issue on Electrostatic Discharge and Immunity—From IC to System......................... MD Ker, D Pommerenke, ZH Jiang, Z Peng, Y Xu, M Yea, S Bub, ... | | |
