| 3D RRAMs with gate-all-around stacked nanosheet transistors for in-memory-computing S Barraud, M Ezzadeen, D Bosch, T Dubreuil, N Castellani, V Meli, ... 2020 IEEE International Electron Devices Meeting (IEDM), 29.5. 1-29.5. 4, 2020 | 15 | 2020 |
| Merging PDKs to build a design environment for 3D circuits: methodology, challenges and limitations O Billoint, K Azizi-Mourier, G Cibrario, D Lattard, M Mouhdach, S Thuries, ... 2019 International 3D Systems Integration Conference (3DIC), 1-5, 2019 | 8 | 2019 |
| 3D sequential integration: applications and associated key enabling modules (design & technology) P Batude, O Billoint, S Thuries, P Malinge, C Fenouillet-Beranger, ... 2021 IEEE International Electron Devices Meeting (IEDM), 3.2. 1-3.2. 4, 2021 | 3 | 2021 |
| 3D sequential integration with Si CMOS stacked on 28nm industrial FDSOI with Cu-ULK iBEOL featuring RO and HDR pixel T Mota-Frutuoso, V Lapras, L Brunet, L Basset, J Lugo, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 1 | 2023 |
| Area and cost analysis of the mixed signal circuits in a novel monolithic 3D process BS Rikan, P Häfliger, G Cibrario, O Billoint, M Mouhdach 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS …, 2021 | 1 | 2021 |
| Opportunities and challenges brought by 3D-sequential integration P Batude, L Brunet, C Fenouillet-Beranger, D Lattard, F Andrieu, M Vinet, ... 2021 IEEE International Interconnect Technology Conference (IITC), 1-1, 2021 | 1 | 2021 |
