| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 19 | 2022 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |
| Design and analysis of thermal transmission line based embedded cooling structures for high bandwidth memory module and 2.5 D/3D ICs K Son, S Kim, S Park, H Park, K Kim, T Shin, M Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 8 | 2020 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 7 | 2021 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Impact of on-chip interconnection in a large-scale memristor crossbar array for neural network accelerator and neuromorphic chip T Shin, K Son, S Kim, K Cho, S Park, S Kim, G Park, B Sim, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 7 | 2019 |
| Thermal and signal integrity co-design and verification of embedded cooling structure with thermal transmission line for high bandwidth memory module K Son, S Kim, H Park, T Shin, K Kim, M Kim, B Sim, S Kim, G Park, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 6 | 2022 |
| Sequential policy network-based optimal passive equalizer design for an arbitrary channel of high bandwidth memory using advantage actor critic S Choi, M Kim, H Park, K Son, S Kim, J Kim, J Park, H Kim, T Shin, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Signal integrity modeling and analysis of large-scale memristor crossbar array in a high-speed neuromorphic system for deep neural network T Shin, S Park, S Kim, S Kim, K Son, H Park, D Lho, K Cho, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 6 | 2021 |
| Deep reinforcement learning-based pin assignment optimization of BGA packages considering signal integrity with graph representation J Park, M Kim, S Kim, K Son, T Shin, H Park, J Kim, S Choi, H Kim, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| Design and measurement of a 28 GHz glass band pass filter based on glass interposers for 5G applications G Park, K Cho, K Son, H Park, D Lho, S Kim, T Shin, Y Kim, J Kim, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 5 | 2019 |
| Analysis of repetitive bending on flexible wireless power transfer (WPT) PCB coils for flexible wearable devices S Jeong, TW Kim, S Lee, B Sim, H Park, K Son, K Son, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 4 | 2022 |
| Scalable transformer network-based reinforcement learning method for PSIJ optimization in HBM H Park, T Shin, S Kim, D Lho, B Sim, J Song, K Kong, J Kim 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 4 | 2022 |
| Eye diagram prediction for input/output buffer information specification-algorithmic modeling interface (IBIS-AMI) J Park, S Kim, T Shin, D Lho, H Park, G Park, J Kim 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo …, 2019 | 4 | 2019 |
| Signal integrity design and analysis of a spiral through-silicon via (TSV) array channel for high bandwidth memory (HBM) S Kim, T Shin, H Park, D Lho, K Son, K Kim, J Park, S Choi, J Kim, H Kim, ... 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 3 | 2021 |
| Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity G Park, H Park, D Lho, J Park, K Son, S Kim, T Shin, K Son, J Park, J Kim, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 3 | 2020 |
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle S Kim, T Shin, S Jeong, H Kang, K Son, S Park, H Kim, J Choi, M Kim, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 3 | 2020 |
