| Dielectric characterization of stacked packaging substrates using a coaxial transmission line technique N Mahjabeen, H McIntyre, Y Goel, SP Gowri, R Henderson 2019 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems …, 2019 | 7 | 2019 |
| Low-cost rapid prototyping of ring resonator for dielectric characterization of packaging substrates N Mahjabeen, J Bright, SR Aroor, N Virushabadoss, S Surendar, ... 2020 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems …, 2020 | 5 | 2020 |
| Design of X-and Ka-Band Reflectarray Antennas for Intercelestial Communication Using CubeSat Relay N Virushabadoss, N Mahjabeen, HSP Bakshi, R Henderson 2021 IEEE Space Hardware and Radio Conference (SHaRC), 31-34, 2021 | 4 | 2021 |
| Extracting Wideband Dielectric Properties of Stacked Packaging Substrates Using Coaxial Airlines N Mahjabeen, R Henderson IEEE Transactions on Microwave Theory and Techniques 69 (1), 887-895, 2020 | 3 | 2020 |
| Broadband measurement of dielectric properties of substrates up to 67 GHz using a coaxial air line N Mahjabeen, AP Zanders, R Henderson 2020 IEEE/MTT-S International Microwave Symposium (IMS), 361-364, 2020 | 3 | 2020 |
| 180 GHz low-loss copper nanowire CPW interconnects A Dave, Y Zhang, N Mahjabeen, A Harpel, R Henderson, B Stadler, ... 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 1034-1036, 2022 | 1 | 2022 |
| Limitations and importance of EM models for on-wafer high frequency performance evaluation N Mahjabeen, Y Zhang, AM Dave, J Um, A Harpel, B Stadler, R Franklin, ... 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 475-478, 2022 | 1 | 2022 |
| Nanowire-based interconnects for sub-millimeter wave integrated circuit applications R Franklin, A Dave, Y Zhang, BJH Stadler, A Harpel, R Henderson, ... US Patent App. 17/843,933, 2023 | | 2023 |
| Broadband Launcher-in-Package using HDI Substrate for Radar Applications N Mahjabeen, R Wenzel, T Zhou 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | | 2023 |
| Package for millimeter wave molecular clock JA Herbsommer, N Mahjabeen, HO Ali, M Moallem US Patent App. 18/334,312, 2023 | | 2023 |
| Package for millimeter wave molecular clock JA Herbsommer, N Mahjabeen, HO Ali, M Moallem US Patent 11,677,406, 2023 | | 2023 |
| Vertically Integrated Nanowires on Si Wafers and Into Circuits A Harpel, J Um, A Dave, Y Zhang, N Mahjabeen, Y Chen, R Henderson, ... IEEE Transactions on Magnetics 59 (3), 1-5, 2022 | | 2022 |
| Millimeter-wave Packaging Materials and CPW Interconnects on Silicon N Mahjabeen | | 2022 |
| 110 GHz Nanowire-Based Integrated Via Technology for 3D Silicon Integration Y Zhang, J Um, N Mahjabeen, B Stadler, R Henderson, R Franklin 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 587-590, 2022 | | 2022 |
| Design and Simulation of a Specification based Vending Machine using Verilog HDL N Mahjabeen, KMA Salam | | |
