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Shuilin WUPeking UniversityVerified email at pku.edu.cn
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Xuenan GuBeihang UniversityVerified email at buaa.edu.cn
Huafang LiCurrent: University of Science and Technology Beijing; Previous: The Chinese University of Hong KongVerified email at ustb.edu.cn
Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Yanbo WangCurrent: Angstron Materals Inc., Previously: Peking UniversityVerified email at angstronmaterials.com
C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
Liyuan ShengShenzhen Institute, Peking UniversityVerified email at imr.ac.cn
Ning WangHong Kong University of Science and TechnologyVerified email at ust.hk
Yinong LiuThe University of Western AustraliaVerified email at uwa.edu.au
Hoi Man WongThe University of Hong KongVerified email at hku.hk
Junqiang Wang (王军强)Chinese Academy of Science, Ningbo Institute of Materials Technology and EngineeringVerified email at nimte.ac.cn
Professor Hong YangThe University of Western AustraliaVerified email at uwa.edu.au
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
Zhong Lin WangGeorgia Institute of Technology; Beijing Institute of Nanoenergy and NanosystemsVerified email at mse.gatech.edu