| Interfacial microstructure and strengthening mechanism of BN-doped metal brazed Ti/SiO2-BN joints ZW Yang, LX Zhang, W Ren, M Lei, JC Feng Journal of the European Ceramic Society 33 (4), 759-768, 2013 | 62 | 2013 |
| Microstructure and wear resistance of a Ni-WC composite coating on titanium grade 2 obtained by electroplating and electron beam remelting Y Li, P Song, W Wang, M Lei, X Li Materials Characterization 170, 110674, 2020 | 42 | 2020 |
| Microstructure and mechanical properties of the Ni-B-Ti composite coating on TA2 prepared by pre-plating and laser remelting Y Li, Y Wu, W Wang, M Lei, X Li Surface and Coatings Technology 405, 126567, 2021 | 25 | 2021 |
| Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging Y Li, Z Wang, X Li, X Hu, M Lei Journal of Materials Science: Materials in Electronics 30, 1519-1530, 2019 | 18 | 2019 |
| Synthesis Fe-Ni protective coating on 45 steel by laser remelting nickel pre-coating dopped with Fe-based amorphous powders Y Li, Y Li, W Wang, M Lei, X Li Materials Characterization 176, 111129, 2021 | 14 | 2021 |
| Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate Y Li, Z Wang, X Li, M Lei Journal of Materials Science: Materials in Electronics 31, 4224-4236, 2020 | 14 | 2020 |
| Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates Y Li, Z Wang, W Long, M Lei, X Hu Journal of Materials Science: Materials in Electronics 29 (16), 13914-13924, 2018 | 14 | 2018 |
| Vacuum wetting of Ag/TA2 to develop a novel micron porous Ti with significant biocompatibility and antibacterial activity G Liu, Y Li, M Yan, J Feng, J Cao, M Lei, Q Liu, X Hu, W Wang, X Li Journal of Materials Science & Technology 116, 180-191, 2022 | 12 | 2022 |
| Interfacial microstructure and formation of direct laser welded CFRP/Ti-6Al-4V joint P Zou, H Zhang, M Lei, D Cheng, S Huang, F Yang Metals 11 (9), 1398, 2021 | 12 | 2021 |
| Reactive wetting of TiC-Ni cermet by Ag-Cu-Zn alloy during evaporation M Lei, JC Feng, XY Tian, JM Shi, LX Zhang Vacuum 138, 22-29, 2017 | 12 | 2017 |
| Brazing of ZrB2–SiC–C and GH99 with AgCuTi/SiC interpenetrating network structural composite as an interlayer LX Zhang, B Zhang, Z Sun, SY Liu, M Lei, JC Feng Ceramics International 46 (8), 10224-10232, 2020 | 11 | 2020 |
| Interfacial microstructure and mechanical properties of the TiC-Ni cermet/Ag-Cu-Zn/Invar joint M Lei, Y Li, H Zhang Vacuum 168, 108830, 2019 | 11 | 2019 |
| Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering Y Li, X Deng, M Lei, X Li, H Ouyang Journal of Materials Science: Materials in Electronics, 1-11, 2022 | 8 | 2022 |
| Formation mechanism of direct laser welding joint between CFRTP and Ti-6Al-4V P Zou, H Zhang, M Lei, D Cheng Materials Letters 325, 132707, 2022 | 6 | 2022 |
| Brazing YAG ceramic to Kovar alloy with Ag–Cu–Ti filler alloy: Wettability, microstructure and mechanical properties Y Li, C Wang, X Li, L Zhang, P Pan, M Lei Vacuum 213, 112093, 2023 | 4 | 2023 |
| Microstructure evolution and wettability of AgCuZn alloy on TiCNi cermet M Lei, Y Li, H Zhang, J Feng, L Zhang Vacuum 159, 500-506, 2019 | 4 | 2019 |
| TFBG Side Modes and Fresnel Reflection-Based Sensing System for Solution Concentration Measurement H Yang, X Li, M Lei, H Ouyang, Y Li IEEE Sensors Journal 23 (7), 6901-6909, 2023 | 2 | 2023 |
| All-fiber hydrofluoric acid sensor based on the dynamic corrosion process of the end face of a fiber tip H Yang, Y Li, M Lei, X Li Optical Fiber Technology 73, 103065, 2022 | 2 | 2022 |
| A novel method for fabricating micron-scale porous structure on the surface of commercially-pure Ti G Liu, Y Li, M Lei, M Yan, X Hu, W Wang, X Li Materials Letters 294, 129802, 2021 | 2 | 2021 |
| Wetting and spreading of AgCuTi on Fe substrate at high temperatures: A molecular dynamics study Y Li, H Wang, L Weng, B Tu, M Lei Journal of Materials Research and Technology 27, 5783-5790, 2023 | 1 | 2023 |
