jie meng
jie meng
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Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints
J Meng, K Kawakami, AK Coskun
Proceedings of the 49th Annual Design Automation Conference, 648-655, 2012
Accelerated microwave design optimization with tuning space mapping
S Koziel, J Meng, JW Bandler, MH Bakr, QS Cheng
IEEE Transactions on Microwave Theory and Techniques 57 (2), 383-394, 2009
Tuning space mapping: A novel technique for engineering design optimization
J Meng, S Koziel, JW Bandler, MH Bakr, QS Cheng
2008 IEEE MTT-S International Microwave Symposium Digest, 991-994, 2008
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
SST+ gem5= a scalable simulation infrastructure for high performance computing
M Hsieh, J Meng, M Levenhagen, K Pedretti, A Coskun, A Rodrigues
Fifth International Conference on Simulation Tools and Techniques, 2012
Analysis and runtime management of 3D systems with stacked DRAM for boosting energy efficiency
J Meng, AK Coskun
2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 611-616, 2012
Simulation and optimization of HPC job allocation for jointly reducing communication and cooling costs
J Meng, S McCauley, F Kaplan, VJ Leung, AK Coskun
Sustainable Computing: Informatics and Systems 6, 48-57, 2015
Optimizing communication and cooling costs in HPC data centers via intelligent job allocation
F Kaplan, J Meng, AK Coskun
2013 International Green Computing Conference Proceedings, 1-10, 2013
Attaining single-chip, high-performance computing through 3D systems with active cooling
A Coskun, D Atienza, M Sabry, J Meng
IEEE Micro 31 (4), 63-75, 2011
Run-time energy management of manycore systems through reconfigurable interconnects
J Meng, C Chen, AK Coskun, A Joshi
Proceedings of the 21st edition of the great lakes symposium on Great lakes …, 2011
Accelerating high-order stencils on GPUs
R Sai, J Mellor-Crummey, X Meng, M Araya-Polo, J Meng
2020 IEEE/ACM Performance Modeling, Benchmarking and Simulation of High …, 2020
Communication and cooling aware job allocation in data centers for communication-intensive workloads
J Meng, E Llamosí, F Kaplan, C Zhang, J Sheng, M Herbordt, G Schirner, ...
Journal of Parallel and Distributed Computing 96, 181-193, 2016
Evaluating performance of OpenMP tasks in a seismic stencil application
E Raut, J Meng, M Araya-Polo, B Chapman
OpenMP: Portable Multi-Level Parallelism on Modern Systems: 16th …, 2020
Porting and evaluation of a distributed task-driven stencil-based application
E Raut, J Anderson, M Araya-Polo, J Meng
Proceedings of the 12th International Workshop on Programming Models and …, 2021
Minimod: A finite difference solver for seismic modeling
J Meng, A Atle, H Calandra, M Araya-Polo
arXiv preprint arXiv:2007.06048, 2020
3D systems with on-chip DRAM for enabling low-power high-performance computing
J Meng, D Rossell, AK Coskun
IEEE High Performance Embedded Computing, HPEC, 1-4, 2011
Express virtual channels with taps (EVC-T): A flow control technique for network-on-chip (NoC) in manycore systems
C Chen, J Meng, AK Coskun, A Joshi
2011 IEEE 19th Annual Symposium on High Performance Interconnects, 1-10, 2011
Exploring performance, power, and temperature characteristics of 3D systems with on-chip DRAM
J Meng, D Rossell, AK Coskun
2011 International Green Computing Conference and Workshops, 1-6, 2011
Dynamic cache pooling in 3D multicore processors
T Zhang, J Meng, AK Coskun
ACM Journal on Emerging Technologies in Computing Systems (JETC) 12 (2), 1-21, 2015
Scalable distributed high-order stencil computations
M Jacquelin, M Araya–Polo, J Meng
SC22: International Conference for High Performance Computing, Networking …, 2022
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