| Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson IEEE Transactions on Components, Packaging, and Manufacturing Technology 5 …, 2015 | 152 | 2015 |
| Fundamental cooling limits for high power density gallium nitride electronics Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015 | 152 | 2015 |
| Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications J Cho, Z Li, E Bozorg-Grayeli, T Kodama, D Francis, F Ejeckam, F Faili, ... IEEE Transactions on Components, Packaging, and Manufacturing Technology 3 …, 2012 | 146 | 2012 |
| Low thermal resistances at GaN–SiC interfaces for HEMT technology J Cho, E Bozorg-Grayeli, DH Altman, M Asheghi, KE Goodson IEEE Electron Device Letters 33 (3), 378-380, 2012 | 133 | 2012 |
| Phonon scattering in strained transition layers for GaN heteroepitaxy J Cho, Y Li, WE Hoke, DH Altman, M Asheghi, KE Goodson Physical Review B 89 (11), 115301, 2014 | 130 | 2014 |
| Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond A Sood, J Cho, KD Hobart, TI Feygelson, BB Pate, M Asheghi, DG Cahill, ... Journal of Applied Physics 119 (17), 2016 | 125 | 2016 |
| Near-junction thermal management: Thermal conduction in gallium nitride composite substrates J Cho, Z Li, M Asheghi, KE Goodson Annual Review of Heat Transfer 18, 2015 | 103 | 2015 |
| Thermal transport: cool electronics J Cho, KE Goodson Nature materials 14, 136-137, 2015 | 92 | 2015 |
| Cooling limits for GaN HEMT technology Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-5, 2013 | 90 | 2013 |
| Phonon conduction in GaN-diamond composite substrates J Cho, D Francis, DH Altman, M Asheghi, KE Goodson Journal of Applied Physics 121 (5), 2017 | 89 | 2017 |
| Interference-free mid-IR laser absorption detection of methane SH Pyun, J Cho, DF Davidson, RK Hanson Measurement Science and Technology 22 (2), 025303, 2011 | 77 | 2011 |
| Analysis and characterization of thermal transport in GaN HEMTs on Diamond substrates D Altman, M Tyhach, J McClymonds, S Kim, S Graham, J Cho, K Goodson, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 76 | 2014 |
| Hierarchically structured laser-induced graphene for enhanced boiling on flexible substrates D Kong, M Kang, KY Kim, J Jang, J Cho, JB In, H Lee ACS Applied Materials & Interfaces 12 (33), 37784-37792, 2020 | 43 | 2020 |
| Characterization of the thermal conductivity of CVD diamond for GaN-on-diamond devices L Yates, A Sood, Z Cheng, T Bougher, K Malcolm, J Cho, M Asheghi, ... 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-4, 2016 | 43 | 2016 |
| Low thermal conductivity of atomic layer deposition yttria-stabilized zirconia (YSZ) thin films for thermal insulation applications J Cho, J Park, J An Journal of the European Ceramic Society 37 (9), 3131-3136, 2017 | 42 | 2017 |
| The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices C Song, J Kim, J Cho International Journal of Heat and Mass Transfer 158, 119992, 2020 | 41 | 2020 |
| Phonon conduction in silicon nanobeam labyrinths W Park, G Romano, EC Ahn, T Kodama, J Park, MT Barako, J Sohn, ... Scientific reports 7 (1), 6233, 2017 | 39 | 2017 |
| S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates M Tyhach, D Altman, S Bernstein, R Korenstein, J Cho, KE Goodson, ... 2014 Lester Eastman Conference on High Performance Devices (LEC), 1-4, 2014 | 39 | 2014 |
| Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates J Cho, Y Won, D Francis, M Asheghi, KE Goodson 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-4, 2014 | 31 | 2014 |
| Thermal characterization of GaN-on-diamond substrates for HEMT applications J Cho, Z Li, E Bozorg-Grayeli, T Kodama, D Francis, F Ejeckam, F Faili, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 27 | 2012 |
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor在 stanford.edu 的电子邮件经过验证
