| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| Effects of oven and laser sintering parameters on the electrical resistance of ijp nano-silver traces on mesoporous pet before and during fatigue cycling GS Khinda, MZ Kokash, M Alhendi, M Yadav, JP Lombardi, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1946-1951, 2019 | 18 | 2019 |
| A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes P Borgesen, L Wentlent, T Alghoul, R Sivasubramony, M Yadav, ... Microelectronics Reliability 95, 65-73, 2019 | 16 | 2019 |
| Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex R Muralidharan, A Raj, RS Sivasubramony, M Yadav, M Alhendi, ... Journal of Materials Research 34 (16), 2903-2910, 2019 | 12 | 2019 |
| Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures M Yadav, T Alghoul, S Thekkut, R Das, C Greene, P Borgesen, ... Journal of Electronic Packaging 144 (3), 031001, 2022 | 10 | 2022 |
| Aging and fatigue of aerosol jet-printed nano-Ag traces on flexible substrate A Raj, RS Sivasubramony, M Yadav, S Thekkut, GS Khinda, M Alhendi, ... Journal of Electronic Packaging 143 (2), 021006, 2021 | 6 | 2021 |
| Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics RS Sivasubramony, AV Zachariah, M Alhendi, M Yadav, P Borgesen, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 768-776, 2019 | 4 | 2019 |
| Effects of Strain Rate and Dwell Time on Fatigue Damage Accumulation in Aerosol Jet Printed Nanosilver Traces on Flex A Raj, M Yadav, NS Adams, RS Sivasubramony, M Alhendi, M Poliks, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 3 | 2020 |
| Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension with Different Amplitudes MDP RS Sivasubramony, M Alhendi, MZ Kokash, M Yadav, A Raj, S Thekkut, E ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1225-1233, 2020 | 3 | 2020 |
| Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor TM Alghoul, M Yadav, S Thekkut, RS Sivasubramony, CM Greene, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 948-953, 2018 | 3 | 2018 |
| A mechanistic model for the life of solder joints under realistic long-term service conditions P Borgesen, L Wentlent, T Alghoul, S Joshi, R Sivasubramony, M Yadav, ... 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 1 | 2018 |
Peter BorgesenProfessor of Systems Science & Industrial Engineering, Binghamton UniversityVerified email at binghamton.edu
