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Xiulin RuanProfessor, School of Mechanical Engineering, Purdue UniversityVerified email at purdue.edu
Yue WuIowa State UniversityVerified email at iastate.edu
Biao Xu (徐骉)Nanjing University of Science and TechnologyVerified email at iastate.edu
Jingjing ShiUniversity of FloridaVerified email at ufl.edu
Som ShresthaOak Ridge National LaboratoryVerified email at ornl.gov
Je-Hyeong BahkUniversity of Cincinnati, OH, USAVerified email at uc.edu
Zhe ChengPeking UniversityVerified email at pku.edu.cn
Janak TiwariGraduate Student, University of UtahVerified email at utah.edu
Bing-Yang Cao (曹炳阳)Professor & Vice dean, School of Aerospace Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
Xiaojia WangAssociate professor of Mechanical Engineering, U of MVerified email at umn.edu
Diana HunGroup Leader, Building Envelopes, Oak Ridge National LaboratoryVerified email at ornl.gov
Juan Carlos IdroboUniversity of WashingtonVerified email at uw.edu
Lucas LindsayOak Ridge National LaboratoryVerified email at ornl.gov
Samuel GrahamUniversity of MarylandVerified email at umd.edu
Zherui Han (韩哲睿)PhD student, Purdue UniversityVerified email at purdue.edu
Mark LundstromProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
Hao ZhouPh.D. student, University of UtahVerified email at utah.edu
Jie ZhuAssociate Professor of Energy and Power Engineering, Dalian University of TechnologyVerified email at dlut.edu.cn
Jesse MaassenAssociate Professor of Physics, Dalhousie UniversityVerified email at dal.ca
Zhenglai ShenOak Ridge National LaboratoryVerified email at ornl.gov
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Tianli Feng
Assistant Professor, Mechanical Engineering, University of Utah
Verified email at utah.edu - Homepage