| Materials merging mechanism of microfluidic electroless interconnection process S Yang, HT Hung, PY Wu, YW Wang, H Nishikawa, CR Kao Journal of The Electrochemical Society 165 (7), D273, 2018 | 22 | 2018 |
| Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications SJ Gräfner, JH Huang, V Renganathan, PY Kung, PY Wu, CR Kao Chemical Engineering Science 269, 118474, 2023 | 5 | 2023 |
| Flow in a microchannel filled with arrays of numerous pillars SJ Gräfner, PY Wu, CR Kao International Journal of Heat and Fluid Flow 97, 109045, 2022 | 4 | 2022 |
| Analysis of an electroless plating problem V Girault, O Pironneau, PY Wu IMA Journal of Numerical Analysis 42 (4), 2884-2923, 2022 | 4 | 2022 |
| Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow PY Wu, O Pironneau, PS Shih, CHR Kao Fluids 6 (11), 371, 2021 | 3 | 2021 |
| Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study SJ Gräfner, JH Huang, PY Wu, V Renganathan, PS Shih, CR Kao Advanced Materials, 2307850, 2023 | | 2023 |
| A Projection Method for Compressible Generic Two-Fluid Model PY Wu arXiv preprint arXiv:2302.09784, 2023 | | 2023 |
| Mathematical Modeling and Numerical Analysis of Electroless Plating Problem in a Microchannel PY Wu Sorbonne université, 2022 | | 2022 |
| Development of a New Spectral Collocation Method Using Laplacian Eigenbasis for Elliptic Partial Differential Equations in an Extended Domain PY Wu, CHR Kao, TWH Sheu arXiv preprint arXiv:1803.02075, 2018 | | 2018 |
| Simulation on the Electroless Plating Problem with Moving Boundaries PY Wu, CR Kao, WH Sheu | | |
