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Co-authors
- Vincent CheungHong Kong University of Science and TechnologyVerified email at pericom.com
- Jun YinAssociate Professor, State Key Laboratory of Analog and Mixed-Signal VLSI, University of MacauVerified email at um.edu.mo
- Liang WuThe Chinese University of Hong Kong, ShenzhenVerified email at ieee.org
- Yue ChaoQualcomm Inc.Verified email at qti.qualcomm.com
- Man-Kay LawUniversity of MacauVerified email at umac.mo
- Amine Bermak, IEEE FellowProfessor, College of Science and Engineering, Hamad Bin Khalifa University,Verified email at hbku.edu.qa
- Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
- Alvin LiHong Kong University of Science and TechnologyVerified email at qti.qualcomm.com
- Xiaolong LiuSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Zhiqiang HuangThe Hong Kong University of Science and Technology (Guangzhou)Verified email at hkust-gz.edu.cn
- Wing-Hung KiThe Hong Kong University of Science and TechnologyVerified email at ust.hk