| An overview of solder bump shape prediction algorithms with validations KN Chiang, CA Yuan IEEE transactions on advanced packaging 24 (2), 158-162, 2001 | 154 | 2001 |
| Current crowding-induced electromigration in SnAg3. 0Cu0. 5 microbumps KN Chiang, CC Lee, CC Lee, KM Chen Applied Physics Letters 88 (7), 2006 | 104 | 2006 |
| Thermal modeling of temperature distribution in metal additive manufacturing considering effects of build layers, latent heat, and temperature-sensitivity of material properties E Mirkoohi, J Ning, P Bocchini, O Fergani, KN Chiang, SY Liang Journal of Manufacturing and Materials Processing 2 (3), 63, 2018 | 100 | 2018 |
| Packaging with metal studs formed on solder pads KC Chang, KN Chiang US Patent App. 10/941,586, 2006 | 87 | 2006 |
| Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor TL Chou, CH Chu, CT Lin, KN Chiang Sensors and Actuators A: Physical 152 (1), 29-38, 2009 | 83 | 2009 |
| Reliability analysis and design for the fine-pitch flip chip BGA packaging CT Peng, CM Liu, JC Lin, HC Cheng, KN Chiang IEEE Transactions on Components and Packaging Technologies 27 (4), 684-693, 2004 | 82 | 2004 |
| Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology CT Peng, JC Lin, CT Lin, KN Chiang Sensors and Actuators A: Physical 119 (1), 28-37, 2005 | 72 | 2005 |
| Electronic packaging reflow shape prediction for the solder mask defined ball grid array KN Chiang, WL Chen | 71 | 1998 |
| On enhancing eutectic solder joint reliability using a second-reflow-process approach KN Chiang, YT Lin, HC Cheng IEEE Transactions on Advanced Packaging 23 (1), 9-14, 2000 | 70 | 2000 |
| Design and analysis of gasket sealing of cylinder head under engine operation conditions CC Lee, KN Chiang, WK Chen, RS Chen Finite Elements in Analysis and Design 41 (11-12), 1160-1174, 2005 | 64 | 2005 |
| Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test TY Hung, SY Chiang, CJ Huang, CC Lee, KN Chiang Microelectronics Reliability 51 (9-11), 1819-1823, 2011 | 60 | 2011 |
| Overview and applicability of residual stress estimation of film–substrate structure TL Chou, SY Yang, KN Chiang Thin Solid Films 519 (22), 7883-7894, 2011 | 55 | 2011 |
| Thermal performance assessment and validation of high-concentration photovoltaic solar cell module TL Chou, ZH Shih, HF Hong, CN Han, KN Chiang IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2012 | 50 | 2012 |
| Analysis of thermal and luminous performance of MR-16 LED lighting module WH Chi, TL Chou, CN Han, SY Yang, KN Chiang IEEE Transactions on Components and Packaging Technologies 33 (4), 713-721, 2010 | 50 | 2010 |
| 3D electronic packaging structure having a conductive support substrate MC Yew, CA Yuan, CY Chou, KN Chiang US Patent 7,884,464, 2011 | 48 | 2011 |
| Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application CT Kuo, MC Yip, KN Chiang Microelectronics Reliability 44 (4), 627-638, 2004 | 48 | 2004 |
| Life prediction of high-cycle fatigue in aluminum bonding wires under power cycling test TY Hung, LL Liao, CC Wang, WH Chi, KN Chiang IEEE Transactions on Device and Materials Reliability 14 (1), 484-492, 2013 | 47 | 2013 |
| Light degradation test and design of thermal performance for high-power light-emitting diodes YF Su, SY Yang, TY Hung, CC Lee, KN Chiang Microelectronics Reliability 52 (5), 794-803, 2012 | 47 | 2012 |
| Microstructure effects on cutting forces and flow stress in ultra-precision machining of polycrystalline brittle materials S Venkatachalam, O Fergani, X Li, J Guo Yang, KN Chiang, SY Liang Journal of Manufacturing Science and Engineering 137 (2), 021020, 2015 | 44 | 2015 |
| Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period TY Hung, CJ Huang, CC Lee, CC Wang, KC Lu, KN Chiang Microelectronic Engineering 107, 125-129, 2013 | 44 | 2013 |
